Abstract: A method of operating a video camera includes capturing a scene of imaging data using a focal plane array (FPA) module of the video camera. The scene of imaging data is characterized by a first bit depth. The method also includes processing, using an image processing module coupled to the FPA module, the scene of imaging data to provide display data characterized by a second bit depth less than the first bit depth. The method further includes forming a super frame including the display data and the scene of imaging data and outputting the super frame.

Abstract: An apparatus for processing a microelectronic workpiece is set forth. The apparatus comprises a workpiece support adapted to hold the microelectronic workpiece and a processing container adapted to receive the microelectronic workpiece held by the workpiece support. A drive mechanism is connected to drive the processing container and the workpiece support relative to one another so that the microelectronic workpiece may be moved to a plurality of workpiece processing positions for processing using processing fluid that is provided by first and second chemical delivery systems. The apparatus also includes first and second chemical collector systems that are used to assist in at least partially removing spent processing fluid. In accordance with one embodiment, the apparatus is particularly adapted to execute an immersion process, such as electroplating, and a spraying process, such as an in-situ rinse.

Abstract: An apparatus for processing a microelectronic workpiece is set forth. The apparatus comprises a workpiece support adapted to hold the microelectronic workpiece and a processing container adapted to receive the microelectronic workpiece held by the workpiece support. A drive mechanism is connected to drive the processing container and the workpiece support relative to one another so that the microelectronic workpiece may be moved to a plurality of workpiece processing positions for processing using processing fluid that is provided by first and second chemical delivery systems. The apparatus also includes first and second chemical collector systems that are used to assist in at least partially removing spent processing fluid. In accordance with one embodiment, the apparatus is particularly adapted to execute an immersion process, such as electroplating, and a spraying process, such as an in-situ rinse.

Abstract: An apparatus for use in processing a workpiece to fabricate a microelectronic component is set forth. The apparatus comprises a process container having a process fluid therein for processing the workpiece and a workpiece holder configured to hold the workpiece. A position sensor is employed to provide position information indicative of the spacing between a surface of the workpiece and a surface of the process fluid. A drive system provides relative movement between the surface of the workpiece and the surface of the process fluid in response to the position information. Preferably, the relative movement provided by the drive system comprises a first motion that causes the surface of the workpiece to contact the surface of the process fluid, and a second motion opposite the direction all of and following the first to generate and maintain a column of process fluid between the surface of the process fluid and the surface of the workpiece.

Abstract: An apparatus for processing a microelectronic workpiece is set forth. The apparatus comprises a workpiece support adapted to hold the microelectronic workpiece and a processing container adapted to receive the microelectronic workpiece held by the workpiece support. A drive mechanism is connected to drive the processing container and the workpiece support relative to one another so that the microelectronic workpiece may be moved to a plurality of workpiece processing positions for processing using processing fluid that is provided by first and second chemical delivery systems. The apparatus also includes first and second chemical collector systems that are used to assist in at least partially removing spent processing fluid. In accordance with one embodiment, the apparatus is particularly adapted to execute an immersion process, such as electroplating, and a spraying process, such as an in-situ rinse.

Abstract: The present invention provides semiconductor workpiece processors and methods of wetting and processing a semiconductor workpiece. One method of wetting and processing a semiconductor workpiece with process fluid comprises providing a semiconductor workpiece having a surface; providing a process fluid; contacting the surface of the semiconductor workpiece with the process fluid; and raising the semiconductor workpiece relative to the process fluid following the contacting.