Patents by Inventor Reed Niederkorn

Reed Niederkorn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8384604
    Abstract: According to various aspects, exemplary embodiments are provided of portable communications terminals and assemblies thereof. In one exemplary embodiment, a portable communications terminal includes a support member. An antenna is supported by the support member. Electromagnetic interference (EMI) shielding structure is also supported by the support member. A printed circuit board includes one or more electronic components mounted thereon. The EMI shielding structure is operable for providing EMI shielding for one or more electronic components that are disposed within the interior defined by the EMI shielding structure and the printed circuit board.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: February 26, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Reed Niederkorn, Torsten Ostervall
  • Patent number: 7969748
    Abstract: According to various aspects, exemplary embodiments are provided of slide assemblies for slidably opening and closing portable communications terminals, which also are configured to provide electromagnetic interference (EMI) shielding for electronic components of a substrate, such as board-mounted electronic components on a printed circuit board (PCB) of a cellular phone, etc. In one exemplary embodiment, a slide assembly generally includes first and second slide members slidably coupled so as to allow the first slide member to be slidably moved relative to the second slide member. EMI shielding structure is along at least one surface of at least one of the first and second slide members.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: June 28, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Reed Niederkorn, Torsten Ostervall
  • Publication number: 20110032692
    Abstract: According to various aspects, exemplary embodiments are provided of slide assemblies for slidably opening and closing portable communications terminals, which also are configured to provide electromagnetic interference (EMI) shielding for electronic components of a substrate, such as board-mounted electronic components on a printed circuit board (PCB) of a cellular phone, etc. In one exemplary embodiment, a slide assembly generally includes first and second slide members slidably coupled so as to allow the first slide member to be slidably moved relative to the second slide member. EMI shielding structure is along at least one surface of at least one of the first and second slide members.
    Type: Application
    Filed: October 18, 2010
    Publication date: February 10, 2011
    Applicant: LAIRD TECHNOLOGIES, INC.
    Inventors: Reed Niederkorn, Torsten Ostervall
  • Publication number: 20110025575
    Abstract: According to various aspects, exemplary embodiments are provided of portable communications terminals and assemblies thereof. In one exemplary embodiment, a portable communications terminal includes a support member. An antenna is supported by the support member. Electromagnetic interference (EMI) shielding structure is also supported by the support member. A printed circuit board includes one or more electronic components mounted thereon. The EMI shielding structure is operable for providing EMI shielding for one or more electronic components that are disposed within the interior defined by the EMI shielding structure and the printed circuit board.
    Type: Application
    Filed: October 18, 2010
    Publication date: February 3, 2011
    Applicant: LAIRD TECHNOLOGIES, INC.
    Inventors: Reed Niederkorn, Torsten Ostervall
  • Publication number: 20020046849
    Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use around access panels and doors in electronic equipment enclosures and elsewhere. The shields may include an electrically nonconductive substrate in combination with an electrically conductive element. In one embodiment, the method may use vapor deposition, plating, or painting techniques for depositing a conductive layer on the substrate surface. In another embodiment the method may use foam-forming to intersperse conductive elements within the substrate. The conductive layer and conductive elements provide effective shielding and grounding functions, and the substrate provides elastic compliancy and resiliency to the shield.
    Type: Application
    Filed: January 24, 2001
    Publication date: April 25, 2002
    Inventors: Martin L. Rapp, Reed Niederkorn, Paul Stus, Larry Creasy