Abstract: A resonator may include a first electrode, a second electrode, and a piezoelectric material between the first electrode and the second electrode, where the piezoelectric material is formed by fabricating the piezoelectric material with a compression axis vector (C-axis vector) oriented along a first direction and applying an electric field across the piezoelectric material to modify a direction of the C-axis vector to be oriented along a second direction. The second direction may be antiparallel to the first direction.

Abstract: A surface acoustic wave (SAW) resonator structure includes a substrate, a piezoelectric layer disposed on the substrate, and an interdigital transducer (IDT) electrode disposed over the piezoelectric layer. The IDT electrode includes multiple busbars and multiple electrode fingers extending from each busbar, where the electrode fingers are configured to generate surface acoustic waves in the piezoelectric layer. The SAW resonator structure further includes dielectric material disposed between the piezoelectric layer and at least at portion of the IDT. The dielectric material may be positioned below tips of the electrode fingers, thereby mass-loading the electrode fingers.

Abstract: An acoustic resonator device includes an annular acoustic resonator, a heater coil and a heat sensor. The annular acoustic resonator is positioned over a trench formed in a substrate of the acoustic resonator device. The heater coil is disposed around a perimeter of the annular acoustic resonator, the heater coil including a resistor configured to receive a heater current. The heat sensor is configured to adjust the heater current in response to a temperature of the heater coil. A feedback circuit is used to control a temperature of the acoustic resonator device.

Abstract: An acoustic resonator device includes an annular acoustic resonator, a heater coil and a heat sensor. The annular acoustic resonator is positioned over a trench formed in a substrate of the acoustic resonator device. The heater coil is disposed around a perimeter of the annular acoustic resonator, the heater coil including a resistor configured to receive a heater current. The heat sensor is configured to adjust the heater current in response to a temperature of the heater coil. A feedback circuit is used to control a temperature of the acoustic resonator device.

Abstract: An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.

Abstract: An apparatus and method are described for synchronizing distribution of packet information. In one embodiment, the invention includes timestamp processing logic to process a transmit time indicator embedded within the packet information, where the transmit time indicator is based on a time reference, and service synchronization queuing logic to hold the packet information until a time offset after the transmit time indicator, where the service synchronization queuing logic is synchronized to the time reference.

Abstract: An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.

Abstract: An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.

Abstract: An apparatus and method are described to increase the control resolution of an electronic device. In one embodiment, the invention includes a spread pulse modulation module to generate a first set of bits based on a second set of bits that is larger than the first set of bits. The spread pulse modulation module modulates the least significant bit (LSB) of the first set of bits based on information including the LSB modulation period and the LSB modulation duty cycle. The spread pulse modulation module also modulates the least significant bit of the first set of bits so that the least significant bit transitions at least twice from a high value to a low value during the modulation period. This embodiment of the invention also includes a digital-to-analog conversion module to generate an analog input signal to the electronic device based on the first set of bits.

Abstract: An apparatus and method are described for synchronizing distribution of packet information. In one embodiment, the invention includes timestamp processing logic to process a transmit time indicator embedded within the packet information, where the transmit time indicator is based on a time reference, and service synchronization queuing logic to hold the packet information until a time offset after the transmit time indicator, where the service synchronization queuing logic is synchronized to the time reference.

Abstract: An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.

Abstract: An apparatus and method are described to increase the control resolution of an electronic device. In one embodiment, the invention includes a spread pulse modulation module to generate a first set of bits based on a second set of bits that is larger than the first set of bits. The spread pulse modulation module modulates the least significant bit (LSB) of the first set of bits based on information including the LSB modulation period and the LSB modulation duty cycle. The spread pulse modulation module also modulates the least significant bit of the first set of bits so that the least significant bit transitions at least twice from a high value to a low value during the modulation period. This embodiment of the invention also includes a digital-to-analog conversion module to generate an analog input signal to the electronic device based on the first set of bits.

Abstract: A GPS receiver and an RF GPS integrated circuit for receiving a GPS signal. The GPS integrated circuit includes a synthesizer for generating LO signals, first and second downconverters for using the LO signals for downconverting the GPS signal, and a sampler for providing in-phase and quadrature phase sampled output signals representative of the GPS signal. The synthesizer includes a multi-mode divider for providing substantially the same first LO frequency at about the midpoint of the L1 and L2 GPS lo frequencies for either of two reference frequencies. The RF GPS integrated circuit uses an entirely on-chip voltage controlled oscillator (VCO) having a resonator for generating the LO signals and an entirely on-chip filter for filtering a first intermediate frequency signal.

Abstract: A GPS/GSM receiver combination for receiving GSM and GPS signals using an RF GPS integrated circuit for downconverting the GPS signal. The GPS integrated circuit includes a synthesizer for generating LO signals, first and second downconverters for using the LO signals for downconverting the GPS signal, and a sampler for providing in-phase and quadrature phase sampled output signals representative of the GPS signal. The synthesizer includes a multi-mode divider for providing substantially the same first LO frequency at about the midpoint of the L1 and L2 GPS frequencies when either of a standard GSM reference frequency or historically common GPS reference frequency is selected. A standby mode in the integrated circuit is controlled by a power logic circuit using a power supply input as a logic control signal.

Abstract: An antenna has a ground plane and a radiating element supported in electrically insulated, closely spaced-apart relation to the ground plane. Electrical energy is fed to the radiating element for radiation therefrom. The radiating element is constructed so as to lengthen at least one effective electrical dimension of the radiating element relative to a corresponding dimension of an orthogonal projection of the radiating element onto a plane parallel to the ground plane. In the preferred embodiment, the radiating element has a central plane portion substantially parallel to the ground plane, an outer flange portion extending towards the ground plane, and a square cutout centered with respect to the central plane portion.

Abstract: An embodiment of the present invention is a single-chip GPS receiver front-end comprising a radio frequency amplifier, a voltage-controlled oscillator operating at a first local oscillator frequency, a divide by seven and one-half counter for deriving a second local oscillator frequency from the first and a first and second mixer. The local oscillator frequency is mid-way between two carrier frequencies of interest that may be received by the radio frequency amplifier and the first mixer produces a first intermediate frequency. The second local oscillator frequency is then beat with the first intermediate frequency in the second mixer to produce a second intermediate frequency. A dual-conversion super heterodyne configuration is therefore employed in which the first and second local oscillator frequencies are derived from a single oscillator and the first local oscillator frequency is seven and one-half times the second local oscillator frequency.