Abstract: An ESD protection circuit for a switching power converter which includes a high-side switching element connected between a supply voltage and the switching node, and a low-side switching element connected between the switching node and a common node. A current conduction path couples an ESD event that occurs on the switching node to an ESD sense node, and an ESD sensing circuit coupled to the sense node generates a trigger signal when an ESD event is sensed. A first logic gate keeps the high-side switching element off when the trigger signal indicates the sensing of an ESD event, and a second logic gate causes the low-side switching element to turn on when an ESD event is sensed such that the low-side switching element provides a conductive discharge path between the switching node and common node.

Abstract: An ESD protection circuit for a switching power converter which includes a high-side switching element connected between a supply voltage and the switching node, and a low-side switching element connected between the switching node and a common node. A current conduction path couples an ESD event that occurs on the switching node to an ESD sense node, and an ESD sensing circuit coupled to the sense node generates a trigger signal when an ESD event is sensed. A first logic gate keeps the high-side switching element off when the trigger signal indicates the sensing of an ESD event, and a second logic gate causes the low-side switching element to turn on when an ESD event is sensed such that the low-side switching element provides a conductive discharge path between the switching node and common node.

Abstract: A FET switching transistor for the solenoid coil of an ABS braking system can switched ON or OFF in no more than substantially 250 ns. A higher current biasing circuit for fast turn on of the FET switching transistor is disconnected when it is necessary to limit the current flowing therethrough, whether during the inrush current to the solenoid coil or due to a fault in the system. The high speed switching of the FET switching transistor causes ringing of the current through the transistor which causes the current detector circuit to exit the current control mode. A deglitch circuit prevents the current detector from exiting the current control mode, so that a timer can be used to turn off the FET switching transistor before it can be damaged by the heat generated during current limit operation.

Abstract: A clamp for a FET switch utilizes a surge detector to turn off one of two bias circuits for the FET. The first biasing circuit provides the current necessary for high speed switching. The second biasing circuit provides a lower biasing current. A resistor or other device is used to allow the measurement of BVdss on the integrated circuit where the surge detector is connected from a terminal of the conductive path of the FET to the gate thereof. The switching circuit allows the surge detector to turn on the FET to act as a self-clamp when there is a spike in the voltage applied to the FET, such as when turning off an inductive load.

Abstract: The present invention provides a system for stress testing an oxide structure to determine that structure's reliability in overstress conditions. The present invention provides an overstress test structure (400) that comprises a first transistor (406), having a first terminal coupled to ground, a second terminal coupled to a control signal (402), and a third terminal coupled to a first end of a first resistive element (412). A first voltage source (414) is coupled to the second end of the first resistive element. A second resistive element (416) is intercoupled between the second end of the first resistive element and ground. A second transistor (418) has a first terminal coupled to the second end of the first resistive element, a second terminal coupled to the first end of the first resistive element, and a third terminal coupled to a first node (420).

Abstract: Disclosed are devices and associated methods for manufacturing an EEPROM memory cell (10) for use on a negatively biased substrate (12). The invention may be practiced using standard semiconductor processing techniques. Devices and methods are disclosed for a floating gate transistor for use as an EEPROM cell (10) including a DNwell (14) formed on a P-type substrate (12) for isolating the EEPROM cell (10) from the underlying P-type substrate (12).

Abstract: Disclosed are devices and associated methods for manufacturing an EEPROM memory cell (10) for use on a negatively biased substrate (12). The invention may be practiced using standard semiconductor processing techniques. Devices and methods are disclosed for a floating gate transistor for use as an EEPROM cell (10) including a DNwell (14) formed on a P-type substrate (12) for isolating the EEPROM cell (10) from the underlying P-type substrate (12).

Abstract: A variable transconductance current mirror circuit includes a first field effect transistor having a gate, a source, and a drain, and a second field effect transistor having a gate, a source, and a drain. The gate of the second transistor is coupled to the gate of the first transistor, and a current source is coupled to the gates of the first and second transistors. The circuit also includes a voltage supply coupled to the sources of the first and second transistors. The circuit further includes a first diode having an anode and a cathode. The anode of the first diode is coupled to the gates of the first and second transistors, and the cathode of the first diode is coupled to the source of the first and second transistors. The first diode comprises a zener diode having a reverse breakdown voltage operable to prevent gate oxide breakdown of the first and second transistors.