Patents by Inventor Rees WINTERS

Rees WINTERS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THROUGH MOLD INTERCONNECT DRILL FEATURE
    Publication number: 20240021500
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and a mold layer over the package substrate and around the first die. In an embodiment, the electronic package further comprises a through mold opening through the mold layer, and a through mold interconnect (TMI) in the through mold opening, wherein a center of the TMI is offset from a center of the through mold opening.
    Type: Application
    Filed: September 28, 2023
    Publication date: January 18, 2024
    Inventors: Robert M. NICKERSON, Rees WINTERS, Purushotham Kaushik MUTHUR SRINATH
  • THROUGH MOLD INTERCONNECT DRILL FEATURE
    Publication number: 20230290708
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and a mold layer over the package substrate and around the first die. In an embodiment, the electronic package further comprises a through mold opening through the mold layer, and a through mold interconnect (TMI) in the through mold opening, wherein a center of the TMI is offset from a center of the through mold opening.
    Type: Application
    Filed: May 16, 2023
    Publication date: September 14, 2023
    Inventors: Robert M. NICKERSON, Rees WINTERS, Purushotham Kaushik MUTHUR SRINATH
  • Through mold interconnect drill feature
    Patent number: 11705383
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and a mold layer over the package substrate and around the first die. In an embodiment, the electronic package further comprises a through mold opening through the mold layer, and a through mold interconnect (TMI) in the through mold opening, wherein a center of the TMI is offset from a center of the through mold opening.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: July 18, 2023
    Assignee: Intel Corporation
    Inventors: Robert M. Nickerson, Rees Winters, Purushotham Kaushik Muthur Srinath
  • Micro-trenching mold interface in a pop package
    Patent number: 11462527
    Abstract: Embodiments disclosed herein include an electronics package. In an embodiment, the electronics package comprises a package substrate and a die on the package substrate. In an embodiment, a mold layer is positioned over the package substrate. In an embodiment, the electronics package further comprises through-mold interconnects through the mold layer, and a trench that extends at least partially into the mold layer.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: October 4, 2022
    Assignee: Intel Corporation
    Inventors: Kumar Abhishek Singh, Zhaozhi Li, Thomas J. Debonis, Robert Nickerson, Rees Winters
  • THROUGH MOLD INTERCONNECT DRILL FEATURE
    Publication number: 20210066167
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and a mold layer over the package substrate and around the first die. In an embodiment, the electronic package further comprises a through mold opening through the mold layer, and a through mold interconnect (TMI) in the through mold opening, wherein a center of the TMI is offset from a center of the through mold opening.
    Type: Application
    Filed: August 26, 2019
    Publication date: March 4, 2021
    Inventors: Robert M. NICKERSON, Rees WINTERS, Purushotham Kaushik MUTHUR SRINATH
  • MICRO-TRENCHING MOLD INTERFACE IN A POP PACKAGE
    Publication number: 20200035658
    Abstract: Embodiments disclosed herein include an electronics package. In an embodiment, the electronics package comprises a package substrate and a die on the package substrate. In an embodiment, a mold layer is positioned over the package substrate. In an embodiment, the electronics package further comprises through-mold interconnects through the mold layer, and a trench that extends at least partially into the mold layer.
    Type: Application
    Filed: July 30, 2018
    Publication date: January 30, 2020
    Inventors: Kumar Abhishek SINGH, Zhaozhi LI, Thomas J. DEBONIS, Robert NICKERSON, Rees WINTERS