Abstract: A cleaning mechanism for an image sensor package, the cleaning mechanism a seal up body is formed with a cleaning room. A substrate formed with frame layer is fixed on the top end of the cleaning room, then, the chamber of the substrate being faced down direction from the cleaning room. A cleaning device is mounted on the bottom end of the cleaning room for cleaning the chamber of the substrate by cleaner.

Abstract: A carrier mechanism for an image sensor package, the carrier is for fixing the transparent layer of the image sensor. The carrier mechanism includes a substrate and plural positioned posts. The substrate has an upper surface, a lower surface, and plural penetrated slots through the upper surface to the lower surface of the substrate. At the periphery of the each penetrated slot of the substrate is formed with plural fixing regions, then the transparent layer is not contact with the upper surface of the substrate. The plurality of positioned post is fixed at the fixing region of the substrate to fix the periphery of the transparent layer.

Abstract: A cleaning mechanism for an image sensor package, the cleaning mechanism a seal up body is formed with a cleaning room. A rotating device is located within the cleaning room of the seal up body. A cleaning device is mounted on the side of the cleaning room of the seal up body, and is cleaned a chamber of a substrate by cleaner.

Abstract: A mechanism for cleaning a transparent layer of an image sensor, the transparent layer has an upper surface and a lower surface, the mechanism includes a transport device for transporting the transparent layer. A first positioned device is arranged under the transport device to position the lower surface of the transparent layer. A first cleaning device is arranged onto the transport device for cleaning the upper surface of the transparent layer. A second positioned device is arranged onto the transport device to position the upper surface of the transparent layer. A second cleaning device is arranged under the transport device for cleaning the lower surface of the transparent layer, respectively, to clean the transparent layer.

Abstract: A clamp for clamping transparent glass for an image sensor package. The clamp includes a first plate and a second plate. The first plate has a first end formed with a first recess, and a second end. The second plate has a first end and a second end connected to the second end of the first plate such that a clamping force may be applied to the first and second plates in order to clamp the transparent glass. The first end of the second plate is formed with a second recess corresponding to the first recess of the first plate so that two lateral sides of the transparent glass may be received in the first recess and the second recess, respectively.