Patents by Inventor Regina Kainzbauer

Regina Kainzbauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for separation of an electrically conductive connection
    Patent number: 8384132
    Abstract: An integrated component includes a semiconductor substrate; at least one interconnect applied on the semiconductor substrate; an insulating layer applied on the at least one interconnect; and at least one opening through the insulating layer which interrupts the at least one interconnect into a first section and a second section.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: February 26, 2013
    Assignee: Infineon Technologies AG
    Inventors: Guenther Ruhl, Markus Hammer, Regina Kainzbauer
  • SYSTEM FOR SEPARATION OF AN ELECTRICALLY CONDUCTIVE CONNECTION
    Publication number: 20100320460
    Abstract: An integrated component includes a semiconductor substrate; at least one interconnect applied on the semiconductor substrate; an insulating layer applied on the at least one interconnect; and at least one opening through the insulating layer which interrupts the at least one interconnect into a first section and a second section.
    Type: Application
    Filed: August 10, 2010
    Publication date: December 23, 2010
    Inventors: Gunther Ruhl, Markus Hammer, Regina Kainzbauer
  • System for separation of an electrically conductive connection
    Patent number: 7799583
    Abstract: An integrated component includes a semiconductor substrate; at least one interconnect applied on the semiconductor substrate; an insulating layer applied on the at least one interconnect; and at least one opening through the insulating layer which interrupts the at least one interconnect into a first section and a second section.
    Type: Grant
    Filed: October 5, 2006
    Date of Patent: September 21, 2010
    Assignee: Infineon Technologies AG
    Inventors: Günther Ruhl, Markus Hammer, Regina Kainzbauer
  • System for separation of an electrically conductive connection
    Publication number: 20080079160
    Abstract: An integrated component includes a semiconductor substrate; at least one interconnect applied on the semiconductor substrate; an insulating layer applied on the at least one interconnect; and at least one opening through the insulating layer which interrupts the at least one interconnect into a first section and a second section.
    Type: Application
    Filed: October 5, 2006
    Publication date: April 3, 2008
    Inventors: Gunther Ruhl, Markus Hammer, Regina Kainzbauer