Patents by Inventor Regina R. Mrozik

Regina R. Mrozik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210018532
    Abstract: A method for acquiring a signal from an encapsulated test point on a device under test, includes forming a hole in an encapsulant adjacent to the test point, the hole extending through the encapsulant to the test point, delivering a UV-curable conductive adhesive into the hole such that the delivered adhesive contacts the test point, applying UV light from a UV light source to cure the delivered adhesive, and connecting a conductive element between the cured adhesive and a test and measurement instrument.
    Type: Application
    Filed: October 4, 2020
    Publication date: January 21, 2021
    Applicant: Tektronix, Inc.
    Inventors: Julie A. Campbell, Karl A. Rinder, Regina R. Mrozik
  • Patent number: 10739381
    Abstract: A method of conductively bonding a test probe tip having an electrically conductive element to a device under test (DUT) having an electrical connection point, the method comprising: positioning the electrically conductive element of the test probe tip proximate to the electrical connection point of the DUT; dispensing a UV-cure conductive adhesive between the electrically conductive element and the electrical connection point of the DUT, the dispensed UV-cure conductive adhesive continuously covering at least a portion of the electrically conductive element and at least a portion of the electrical connection point of the DUT; and bonding the dispensed UV-cure conductive adhesive to the electrically conductive element and the electrical connection point of the DUT by applying UV-light from a UV-light source to the dispensed UV-cure conductive adhesive.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: August 11, 2020
    Assignee: Tektronix, Inc.
    Inventors: Julie A. Campbell, Regina R. Mrozik
  • Publication number: 20180340956
    Abstract: A method of conductively bonding a test probe tip having an electrically conductive element to a device under test (DUT) having an electrical connection point, the method comprising: positioning the electrically conductive element of the test probe tip proximate to the electrical connection point of the DUT; dispensing a UV-cure conductive adhesive between the electrically conductive element and the electrical connection point of the DUT, the dispensed UV-cure conductive adhesive continuously covering at least a portion of the electrically conductive element and at least a portion of the electrical connection point of the DUT; and bonding the dispensed UV-cure conductive adhesive to the electrically conductive element and the electrical connection point of the DUT by applying UV-light from a UV-light source to the dispensed UV-cure conductive adhesive.
    Type: Application
    Filed: May 11, 2018
    Publication date: November 29, 2018
    Applicant: Tektronix, Inc.
    Inventors: Julie A. Campbell, Regina R. Mrozik