Patents by Inventor Regina Stokan

Regina Stokan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating a semiconductor component having a wiring which runs piecewise in the substrate, and also a semiconductor component which can be fabricated by this method
    Patent number: 6440827
    Abstract: A method for fabricating a wiring which runs at least piecewise in a substrate. At least one conductive connection runs in the semiconductor substrate and at least one conductive connection runs on the semiconductor substrate being provided. The semiconductor component enables applications in which high security against external manipulations is important.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: August 27, 2002
    Assignee: Infineon Technologies AG
    Inventors: Helga Braun, Ronald Kakoschke, Regina Stokan, Andreas Kux, Gunther Plasa
  • Semiconductor component with silicon wiring and method of fabricating the component
    Patent number: 6429520
    Abstract: A semiconductor component has local silicon wiring. A first silicon region and a second silicon region are doped with dopants of opposite conductivity. The second silicon region is arranged at least partially over the first silicon region and is separated from it by an insulation layer. The insulation layer is formed with an opening. A conductive layer is disposed at the opening. The conductive layer is composed of a metal, a metal nitride or a combination thereof and connects the first and the second silicon regions electrically to one another.
    Type: Grant
    Filed: September 7, 1999
    Date of Patent: August 6, 2002
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ronald Kakoschke, Regina Stokan
  • Method for fabricating a semiconductor component having a wiring which runs piecewise in the substrate, and also a semiconductor component which can be fabricated by this method
    Publication number: 20010053574
    Abstract: A method for fabricating a wiring which runs at least piecewise in a substrate. At least one conductive connection runs in the semiconductor substrate and at least one conductive connection runs on the semiconductor substrate being provided. The semiconductor component enables applications in which high security against external manipulations is important.
    Type: Application
    Filed: May 11, 2001
    Publication date: December 20, 2001
    Inventors: Helga Braun, Ronald Kakoschke, Regina Stokan, Gunther Plasa, Andreas Kux