Abstract: The invention provides a method of applying an overlay conductor between at least a pair of connection land areas on a surface of a printed circuit board. The pattern of the conductor is first defined by the application of a dielectric material between the pair of land areas. A silver polymer ink is then applied over the dielectric material and over only a portion of each land area. The polymer ink is then cured by exposure to a source of heat. The pair of land areas and at least the portion of the cured ink overlaying the land areas are then covered with silver solder paste which is subsequently reflowed by exposure to a source of heat and allowed to solidify thereby attaching the conductor to the land area and providing a secure conductive connection.

Abstract: The invention provides a process for forming an electrical conductor pattern on desired areas of a substrate comprising the steps of applying a predetermined pattern of silver polymer ink on the substrate and at least partially curing it. A layer of silver solder paste is then applied over the cured polymer ink to a width larger than that of the ink. The solder paste is then reflowed and allowed to solidify, whereby the silver polymer ink becomes encapsulated in the reflowed silver solder to form the desired pattern of conductors which may then be covered with a layer of dielectric material comprising a cured non-conductive polymer ink.