Abstract: The invention provides a substrate surface imaging method and apparatus that compensates for non-linear movement of the substrate surface during an imaging sequence. In one aspect of the invention, the imaging method and apparatus compensate for the non-linear substrate surface movement by adjusting the image receiver trigger points to correspond to image positions on the substrate surface. In another aspect, the invention provides synchronous imaging where the distance between each image position is determined by counting the number of stepper motor steps between image positions. In still another aspect, the invention provides for asynchronous substrate imaging by determining an image trigger time between each image position and using the image trigger time to trigger the receiver at the appropriate time to accurately image the substrate surface.

Abstract: A battery powered sensing device for diagnosing a processing system and method for using the same are provided. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.

Abstract: A battery powered sensing device for diagnosing a processing system and method for using the same are provided. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.

Abstract: The invention provides a substrate surface imaging method and apparatus that compensates for non-linear movement of the substrate surface during an imaging sequence. In one aspect of the invention, the imaging method and apparatus compensate for the non-linear substrate surface movement by adjusting the image receiver trigger points to correspond to image positions on the substrate surface. In another aspect, the invention provides synchronous imaging where the distance between each image position is determined by counting the number of stepper motor steps between image positions. In still another aspect, the invention provides for asynchronous substrate imaging by determining an image trigger time between each image position and using the image trigger time to trigger the receiver at the appropriate time to accurately image the substrate surface.

Abstract: A battery powered sensing device for diagnosing a processing system and method for using the same are provided. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.

Abstract: A battery powered sensing device for diagnosing a processing system and method for using the same are provided. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.

Abstract: The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. In one embodiment, a substrate process inspection system comprises a plurality of optical inspection systems each configured to perform an optical inspection process at a first degree of optical resolution and an inspection platform configured to perform an optical inspection process at a second degree of optical resolution. The plurality of optical inspection systems each comprises a transmitter unit and a receiver unit. The substrate process inspection system further comprises a controller system connected to the plurality of optical inspection systems and the inspection platform.

Abstract: A sensor device, for diagnosing a processing system, generally includes a support platform and one or more sensors mounted on the support platform. The sensor senses a condition, such as direction or inclination or acceleration in one or two axes, of the sensor device and outputs a signal indicative thereof, which is then transferred to a device on or near the processing system. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.

Abstract: A sensor device, for diagnosing a processing system, generally includes a support platform and one or more sensors mounted on the support platform. The sensor senses a condition, such as direction or inclination or acceleration in one or two axes, of the sensor device and outputs a signal indicative thereof, which is then sent to a transmitter, also mounted to the support platform, for wireless transmission of the signal to a receiver mounted on or near the processing system. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.

Abstract: The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. In one aspect, a light source is used in conjunction with an optical receiving device, such as a camera having a CCD, to illuminate and inspect a substrate for various optical signatures. The data collected during an inspection cycle is processed to determine substrate topography information. In one embodiment, the data is used to generate mean values indicative of signal intensity and/or color. One aspect provides for specular signature analysis where a reference histogram is subtracted from a test substrate histogram. The mean values are then compared to reference values to determine topographical conditions. Advantageously, a data processing system may be used to collect the data, perform the specular signature analysis, and determine the resultant processing conditions.

Abstract: Embodiments of the invention generally provide a method for enhancing chemical reactions within a substrate processing chamber during a substrate processing sequence. The method generally includes supporting a substrate in a face up position on a substrate support member, providing a process gas into the processing chamber, and striking a plasma of the process gas. The method further includes imparting at least one impulse to the substrate support member that is substantially perpendicular to a substrate surface, the at least one impulse being of sufficient magnitude to agitate the substrate surface to expand an exposed surface area of the substrate surface.

Abstract: The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. In one aspect, a par of light sources is used in conjunction with an optical receiving device, such as a camera having a CCD, to illuminate and inspect a substrate for various optical signatures. The substrate signatures are then used to generate images of obstructions in three dimensions (3-D) for further analysis. In one embodiment, the substrate is scanned in two or more directions with a first light source and then scanned in two or more directions with a second light source. A receiver captures the reflected and/or scatted signals from sources comprising two or more different images. The light illumination from the first and second light sources impinges on substrate surface obstructions from two differing angles (i.e. perspectives).

Abstract: The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. More specifically, a method and apparatus providing embedded substrate monitoring through consolidation of multiple process inspection techniques in semiconductor processing equipment is disclosed. In one aspect, an optical inspection system comprising a light source and an optical receiving device, such as a CCD camera, is used to illuminate and inspect a substrate for various optical signatures. A plurality of optical inspection systems are strategically located in a cluster tool environment in order to collect optical information during processing steps. Taken together, the plurality of optical inspection systems operate as a monitoring system to determine substrate process conditions and routing.

Abstract: The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. More specifically, optical signal routing methods and apparatus provide multiple inspection collection points on a semiconductor processing system. In one aspect, an optical inspection system comprises a light source and an optical receiving device, such as a CCD camera, to illuminate and inspect a substrate for various optical signatures. A plurality of optical inspection systems are connected to a signal switching device, such as a multiplexer, which operates to route a particular signal to a detector.

Abstract: The present invention generally provides an apparatus and a method for scanning a substrate in a processing system. A transmitter unit and a receiver unit are disposed on a processing system and cooperate to transmit and detect energy, respectively. The transmitter unit is positioned to transmit a signal onto the substrate surface moving between vacuum chambers, one of which is preferably a transfer chamber of a cluster tool. Features disposed on the substrate surface, which may include particles, devices, alphanumeric characters, the substrate edges, notches, etc., cause a scattering or reflection of a portion of the signal. The receiver unit is disposed to collect the scattered/reflected portion of the signal and direct the same to a processing unit. Preferably, the transmitter unit comprises a laser source and the receiver unit comprises a charged-coupled device (CCD).

Abstract: The present invention generally provides an apparatus and a method for scanning a substrate in a processing system. A transmitter unit and a receiver unit are disposed on a processing system and cooperate to transmit and detect energy, respectively. The transmitter unit is positioned to transmit a signal onto the substrate surface moving between vacuum chambers, one of which is preferably a transfer chamber of a cluster tool. Features disposed on the substrate surface, which may include particles, devices, alphanumeric characters, the substrate edges, notches, etc., cause a scattering or reflection of a portion of the signal. The receiver unit is disposed to collect the scattered/reflected portion of the signal and direct the same to a processing unit. Preferably, the transmitter unit comprises a laser source and the receiver unit comprises a charged-coupled device (CCD).

Abstract: The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. In one aspect, a light source is used in conjunction with an optical receiving device, such as a spectrometer, to illuminate and inspect a substrate for various optical signatures. In one embodiment, spectral data collected from a given substrate is used to generate a spectral signature. The spectral signature represents the intensity distribution of the color sonstituents of a substrate surface. This color signature may then be compared to a reference color signature to determine characteristics such as the substrate type, thickness, conformity, substrate surface uniformity, and residual materials in processing.

Abstract: A sensor device, for diagnosing a processing system, generally includes a support platform and one or more sensors mounted on the support platform. The sensor senses a condition, such as direction or inclination or acceleration in one or two axes, of the sensor device and outputs a signal indicative thereof, which is then sent to a transmitter, also mounted to the support platform, for wireless transmission of the signal to a receiver mounted on or near the processing system. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.

Abstract: A sensor device, for diagnosing a processing system, generally includes a support platform and one or more sensors mounted on the support platform. The sensor senses a condition, such as direction or inclination or acceleration in one or two axes, of the sensor device and outputs a signal indicative thereof, which is then sent to a transmitter, also mounted to the support platform, for wireless transmission of the signal to a receiver mounted on or near the processing system. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.

Abstract: A sensor device, for diagnosing a processing system, generally includes a support platform and one or more sensors mounted on the support platform. The sensor senses a condition, such as direction or inclination or acceleration in one or two axes, of the sensor device and outputs a signal indicative thereof, which is then sent to a transmitter, also mounted to the support platform, for wireless transmission of the signal to a receiver mounted on or near the processing system. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.