Patents by Inventor Reginald Murray

Reginald Murray has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallic bonding method
    Patent number: 4046305
    Abstract: Bonded metallic structures comprising at least two pieces each of a metallic aluminous substance selected from the group consisting of aluminium and aluminium alloys are formed by bonding the pieces together by eutectic diffusion bonding using a metallic interlayer material which is applied between the surfaces to be joined, which forms a less stable oxide than that formed by the aluminous substance and which is preferably selected from the group consisting of copper and copper-rich alloys including at least about 95% copper.
    Type: Grant
    Filed: October 28, 1975
    Date of Patent: September 6, 1977
    Assignee: Associated Engineering Limited
    Inventors: Dennis Cockburn Brown, Reginald Murray