Abstract: A leadframe comprises interconnect leads for providing connection between wire bonding leads extending from bondpads on a semiconductor die and conductors of an integrated circuit package in a one-to-one relationship. The bondpads on the semiconductor die are grouped into at least one set, the bondpads therein being substantially equidistantly spaced along a linear baseline. Each of the interconnect leads has a bondtarget at one end thereof for connection to a respective wire bonding lead and is substantially equidistantly juxtaposed from a point corresponding to the position of a respective bondpad and extending collinearly from a linear extension of the respective point to the bondtarget. The spacing between adjacent bondtargets is substantially equidistant and substantially greater than the spacing between adjacent bondpads so that the bondtargets form a set in the form of a contiguous arc.