Abstract: An embodiment sensor includes a hybrid waveguide. The hybrid waveguide includes a first dielectric optical waveguide lying on and in contact with a dielectric support layer; a first surface waveguide optically coupled to the first dielectric optical waveguide, parallel to the first dielectric optical waveguide, and lying on the dielectric support layer. The first surface waveguide has a lateral surface configured to guide a surface mode. The hybrid waveguide includes a cavity intended to be filled with a dielectric fluid, separating laterally the first dielectric optical waveguide from the lateral surface of the first surface waveguide.

Abstract: Method of producing a photonic device including at least one light source and at least one photodetector on a structure including a waveguide layer, this method comprising the following steps: a) growing successively on a substrate (10), a photodetection structure (11) and a light source structure (12), the photodetection structure and the light source structure being made of a stack of layers, the light source layers being stacked on top of the photodetector layers and both structures sharing one of these layers.

Abstract: Optical device with superimposed photonic circuits, for coupling to an optical waveguide. Said device comprises a substrate (44) and, on said substrate, an integrated photonic circuit (46) adapted to be coupled to at least one optical waveguide (48) which transmits a light signal (50) and for processing said signal. According to the invention, the circuit comprises two superimposed elementary integrated photonic circuits (52, 54), each of which is adapted to be coupled to a given polarization state of the signal and to process this state. The invention applies particularly to optical telecommunications.

Abstract: Method of producing a photonic device including at least one light source and at least one photodetector on a structure including a waveguide layer, this method comprising the following steps: a) growing successively on a substrate (10), a photodetection structure (11) and a light source structure (12), the photodetection structure and the light source structure being made of a stack of layers, the light source layers being stacked on top of the photodetector layers and both structures sharing one of these layers.

Abstract: A non-destructive method for characterizing a surface-illuminated integrated optical coupler associated with an optical waveguide, comprising the steps of measuring the reflection coefficient on a first region of the coupler at a distance from the optical waveguide and constructing a first curve, determining a first model of the reflection coefficient on the first region, performing a first parameter fitting between the first curve and the first model to determine first parameters, measuring the reflection coefficient on a second region of the coupler close to the guide, and constructing a second curve, determining a second model of the reflection coefficient on the second region, performing a second parameter fitting between the second curve and the second model to determine second parameters, and constructing the characteristic of the coupling efficiency of the coupler using the first and second parameters.

Abstract: Said device comprises a substrate (44) and, on said substrate, an integrated photonic circuit (46) adapted to be coupled to at least one optical waveguide (48) which transmits a light signal (50) and for processing said signal. According to the invention, the circuit comprises two superimposed elementary integrated photonic circuits (52, 54), each of which is adapted to be coupled to a given polarisation state of the signal and to process this state. The invention applies particularly to optical telecommunications.

Abstract: A non-destructive method for characterizing a surface-illuminated integrated optical coupler associated with an optical waveguide, comprising the steps of measuring the reflection coefficient on a first region of the coupler at a distance from the optical waveguide and constructing a first curve, determining a first model of the reflection coefficient on the first region, performing a first parameter fitting between the first curve and the first model to determine first parameters, measuring the reflection coefficient on a second region of the coupler close to the guide, and constructing a second curve, determining a second model of the reflection coefficient on the second region, performing a second parameter fitting between the second curve and the second model to determine second parameters, and constructing the characteristic of the coupling efficiency of the coupler using the first and second parameters.