Abstract: Disclosed herein are structures and techniques for exposing circuitry in die testing. For example, in some embodiments, an integrated circuit (IC) die may include: first conductive contacts at a first face of the die; second conductive contacts at a second face of the die; die stack emulation circuitry; other circuitry; and a switch coupled to the second conductive contacts, the die stack emulation circuitry, and the other circuitry, wherein the switch is to couple the second conductive contacts to the other circuitry when the switch is in a first state, and the switch is to couple the die stack emulation circuitry to the other circuitry when the switch is in a second state different from the first state.

Abstract: Disclosed herein are structures and techniques for exposing circuitry in die testing. For example, in some embodiments, an integrated circuit (IC) die may include: first conductive contacts at a first face of the die; second conductive contacts at a second face of the die; die stack emulation circuitry; other circuitry; and a switch coupled to the second conductive contacts, the die stack emulation circuitry, and the other circuitry, wherein the switch is to couple the second conductive contacts to the other circuitry when the switch is in a first state, and the switch is to couple the die stack emulation circuitry to the other circuitry when the switch is in a second state different from the first state.

Abstract: A high volume manufacturing (HVM) and circuit marginality validation (CMV) test for an integrated circuit (IC) is disclosed. The IC comprises a port binding and bubble logic in the front end to provide flexibility in binding a port to the uop and to create empty spaces (bubbles) in the uop flow. The out-of-order (OOO) cluster of the IC comprises reservation disable logic to control the flow sequence of the uops and stop schedule logic to temporarily stop dispatching the uops from the OOO cluster to the execution (EXE) cluster. The EXE cluster of the IC comprises signal event uops to generate fault information and fused uJump uops to specify combination of branch prediction, direction, and resolution in any portion of the test. Such features provide a tester the flexibility to perform HVM and CMV testing of the OOO and EXE clusters of the IC.

Abstract: A high volume manufacturing (HVM) and circuit marginality validation (CMV) test for an integrated circuit (IC) is disclosed. The IC comprises a port binding and bubble logic in the front end to provide flexibility in binding a port to the uop and to create empty spaces (bubbles) in the uop flow. The out-of-order (OOO) cluster of the IC comprises reservation disable logic to control the flow sequence of the uops and stop schedule logic to temporarily stop dispatching the uops from the OOO cluster to the execution (EXE) cluster. The EXE cluster of the IC comprises signal event uops to generate fault information and fused uJump uops to specify combination of branch prediction, direction, and resolution in any portion of the test. Such features provide a tester the flexibility to perform HVM and CMV testing of the OOO and EXE clusters of the IC.