Abstract: A bonding apparatus 10 includes: a bonding head 18 configured to move a top camera 24 facing toward a bonding surface and a collet 22 disposed with an offset from the top camera 24, while integrally holding the top camera 24 and the collet 22; a bottom camera 28 facing toward the collet 22 so as to detect a position of a semiconductor chip 100 held by the collet 22 with respect to the collet 22; a reference mark 32 disposed within a view field of the bottom camera 28; and a control unit 40. The control unit 40 moves the bonding head 18 based on a position of the mark 32 recognized by the top camera 24, and then calculates a value of the offset based on a position of the collet 22 with respect to the mark 32 recognized by the bottom camera 28. With this, it is possible to provide a bonding apparatus capable of easily detecting an offset between a bonding tool and a position detection camera without providing a dedicated camera.