Patents by Inventor Rei-Feng Chung

Rei-Feng Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060077876
    Abstract: A recording medium. A recording layer is disposed overlying a substrate. A moisture barrier layer is disposed overlying the recording layer. A reflecting layer is disposed overlying the moisture barrier layer. An adhesion layer is disposed overlying the reflecting layer. Due to the static moisture barrier layer interposed between the reflecting layer and the recording layer in an embodiment of the invention, moisture interpenetration from ambience can be diminished to improve weather and corrosion resistance of the recording medium.
    Type: Application
    Filed: September 9, 2005
    Publication date: April 13, 2006
    Applicant: Daxon Technology Inc.
    Inventors: Chia-Sheng Lin, Rei-Feng Chung, Hsiang-Ling Huang