Patents by Inventor Rei Fujimaki
Rei Fujimaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10343238Abstract: Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.Type: GrantFiled: June 5, 2017Date of Patent: July 9, 2019Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Masayuki Suzuki, Naoko Izumita, Shunsaku Yoshikawa, Ken Tachibana, Rei Fujimaki, Hikaru Nomura
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Patent number: 10272527Abstract: Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-4% of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.Type: GrantFiled: April 2, 2015Date of Patent: April 30, 2019Assignee: Senju Metal Industry Co., Ltd.Inventors: Minoru Ueshima, Takeshi Sakamoto, Rei Fujimaki
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Patent number: 10265807Abstract: Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-4% of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.Type: GrantFiled: May 17, 2018Date of Patent: April 23, 2019Assignee: Senju Metal Industry Co., Ltd.Inventors: Minoru Ueshima, Takeshi Sakamoto, Rei Fujimaki
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Patent number: 10137536Abstract: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.Type: GrantFiled: December 25, 2012Date of Patent: November 27, 2018Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Tsukasa Ohnishi, Shunsaku Yoshikawa, Seiko Ishibashi, Rei Fujimaki
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Publication number: 20180264601Abstract: Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-4% of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.Type: ApplicationFiled: May 17, 2018Publication date: September 20, 2018Inventors: Minoru Ueshima, Takeshi Sakamoto, Rei Fujimaki
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Publication number: 20180001426Abstract: Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.Type: ApplicationFiled: June 5, 2017Publication date: January 4, 2018Inventors: Masayuki SUZUKI, Naoko IZUMITA, Shunsaku YOSHIKAWA, Ken TACHIBANA, Rei FUJIMAKI, Hikaru NOMURA
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Patent number: 9796053Abstract: Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250° C. In order to make the structure of an Sn—Sb—Ag—Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass %, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.Type: GrantFiled: July 29, 2013Date of Patent: October 24, 2017Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Rei Fujimaki, Minoru Ueshima
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Publication number: 20170014955Abstract: Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-40 of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.Type: ApplicationFiled: April 2, 2015Publication date: January 19, 2017Inventors: Minoru UESHIMA, Takeshi SAKAMOTO, Rei FUJIMAKI
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Publication number: 20150328722Abstract: Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.Type: ApplicationFiled: December 18, 2012Publication date: November 19, 2015Inventors: Masayuki SUZUKI, Naoko HIRAI, Shunsaku YOSHIKAWA, Ken TACHIBANA, Rei FUJIMAKI, Hikaru NOMURA
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Publication number: 20150217410Abstract: Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250° C. In order to make the structure of an Sn—Sb—Ag—Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass %, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.Type: ApplicationFiled: July 29, 2013Publication date: August 6, 2015Applicant: SENJUMETAL INDUSTRY CO., LTD.Inventors: Rei Fujimaki, Minoru Ueshima
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Publication number: 20150029670Abstract: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.Type: ApplicationFiled: December 25, 2012Publication date: January 29, 2015Inventors: Tsukasa Ohnishi, Shunsaku Yoshikawa, Seiko Ishibashi, Rei Fujimaki
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Patent number: 8865062Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.Type: GrantFiled: August 8, 2012Date of Patent: October 21, 2014Assignee: Senju Metal Industry Co., Ltd.Inventors: Minoru Ueshima, Rei Fujimaki
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Publication number: 20140044479Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.Type: ApplicationFiled: August 8, 2012Publication date: February 13, 2014Inventors: Minoru Ueshima, Rei Fujimaki