Patents by Inventor Rei HAYAKAWA

Rei HAYAKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11473788
    Abstract: An outdoor unit of an air-conditioning apparatus enabling a soundproof material to correctly cover a compressor and having enhanced assembling efficiency and a method for assembling the outdoor unit of an air-conditioning apparatus are provided. The outdoor unit of an air-conditioning apparatus includes the compressor installed inside a casing and the soundproof material covering at least the compressor. The soundproof material includes a lower soundproof material surrounding a lateral periphery of a lower portion of the compressor and an upper soundproof material surrounding a lateral periphery of an upper portion of the compressor.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: October 18, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yo Kitabatake, Shigeru Hata, Keiichi Tomita, Yohei Kawaguchi, Rei Hayakawa, Kento Oku
  • Publication number: 20200041145
    Abstract: An outdoor unit of an air-conditioning apparatus enabling a soundproof material to correctly cover a compressor and having enhanced assembling efficiency and a method for assembling the outdoor unit of an air-conditioning apparatus are provided. The outdoor unit of an air-conditioning apparatus includes the compressor installed inside a casing and the soundproof material covering at least the compressor. The soundproof material includes a lower soundproof material surrounding a lateral periphery of a lower portion of the compressor and an upper soundproof material surrounding a lateral periphery of an upper portion of the compressor.
    Type: Application
    Filed: December 21, 2016
    Publication date: February 6, 2020
    Inventors: Yo KITABATAKE, Shigeru HATA, Keiichi TOMITA, Yohei KAWAGUCHI, Rei HAYAKAWA, Kento OKU
  • Publication number: 20190024911
    Abstract: An electrical component module is provided in which a heat sink is applied as a cooling unit for a power element and space can be saved. The electrical component module includes: a first holder having substrate holding structures on a first surface portion and a second surface portion located on a back-surface side of the first surface portion; a second holder disposed perpendicular to the first holder at an end portion of the second surface portion of the first holder and having a substrate holding structure on one surface of the second holder; a first substrate held on the first surface portion of the first holder; a second substrate and a heat sink both held by the second holder; and a third substrate held on the second surface portion of the first holder, and connected to the first substrate and the second substrate by a line.
    Type: Application
    Filed: March 4, 2016
    Publication date: January 24, 2019
    Inventors: Rei HAYAKAWA, Yohei KAWAGUCHI, Shigeru HATA