Abstract: An ultrasonic component packaging structure includes a substrate, an ultrasonic component, a first pin, a second pin, and a protective shell. The substrate includes a first connection pad and a second connection pad. The ultrasonic component includes a first electrode and a second electrode that are electrically connected to the first connection pad and the second connection pad respectively. The first pin and the second pin are electrically connected to the first connection pad and the second connection pad respectively, and extend in an opposite direction of the ultrasonic component. The protective shell surrounds the substrate and the ultrasonic component, and is provided with a first opening to expose the ultrasonic component. Based on the design of the pins, the ultrasonic component can be fixed in a plugging manner, so that interference between ultrasonic components can be avoided, and a sensing distance can be effectively shortened.

Abstract: A transmission component assembly includes a transmission module, a short-range ultrasonic sensor, and a microprocessor. The transmission module includes a motor, a rotating shaft, and a gear wheel. The gear wheel includes a plurality of teeth with different lengths. Each of the teeth corresponds to a rotation angle of the rotating shaft. The motor drives the rotating shaft and the gear wheel to rotate. A sensing distance between the short-range ultrasonic sensor and the gear wheel is less than 8 centimeters. The short-range ultrasonic sensor generates an ultrasonic signal with a frequency greater than 500 KHz, and receives an ultrasonic reflection signal reflected by the gear wheel. A transmitting angle and a receiving angle of the short-range ultrasonic sensor are less than 10 degrees. The microprocessor calculates the rotation angle based on the sensing signal converted from the ultrasonic reflection signal, and transmits a driving signal to the motor.

Abstract: An ultrasonic mouse includes an ultrasonic module, a processing unit, and a transmission interface. The ultrasonic module includes an ultrasonic emitting element and a plurality of ultrasonic receiving elements, the ultrasonic receiving elements and the ultrasonic emitting element are arranged in a matrix, and the ultrasonic receiving elements are arranged surrounding the ultrasonic emitting element. The ultrasonic emitting element generates an ultrasonic signal. When the ultrasonic mouse moves, at least one of the ultrasonic receiving elements generates sensing information upon receiving the ultrasonic signal. The processing unit is electrically connected to the ultrasonic module, receives the sensing information, and calculates and generates a movement signal. The transmission interface is electrically connected to the processing unit, and transmits the movement signal out.

Abstract: A proximity ultrasonic sensing apparatus includes a microprocessor and an ultrasonic sensing assembly. The microprocessor generates a control signal. The ultrasonic sensing assembly includes a boost circuit to boost the control signal into a driving signal, an ultrasonic transmitting module to generates and sends an ultrasonic signal according to the driving signal, an ultrasonic receiving module to converts reflection of the ultrasonic signal into a reflection signal, and an amplifying circuit to amplifies the reflection signal into a sensing signal. A transmitting/receiving angle of the ultrasonic transmitting module and the ultrasonic receiving module is in a range of 2 to 10 degrees. The microprocessor generates a sensing result according to the sensing signal. A frequency of the ultrasonic signal is in a range of 500 KHz to 1.2 MHz. A sensing distance of the ultrasonic sensing assembly is in a range of 0.2 to 8 centimeters.

Abstract: An ultrasonic sensing element assembly includes a semiconductor substrate and a plurality of ultrasonic sensing elements on the semiconductor substrate and arranged in an array. Each of the ultrasonic sensing elements is in a sensing region of the semiconductor substrate. Each of the ultrasonic sensing elements includes a first sensing module with a first sensing unit and a second sensing unit connected in parallel, a second sensing module with a third sensing unit and a fourth sensing unit connected in parallel, four connection pads, and four welding pads. Each of the connection pads is in a through hole passing through a first surface and a second surface of the sensing region. The four welding pads are on the second surface of the sensing region and overlap vertical projections of the first sensing unit, the second sensing unit, the third sensing unit, and the fourth sensing unit respectively.

Abstract: A package structure of a piezoelectric micromachined ultrasonic transducer includes a silicon substrate, a first protective layer, a piezoelectric composite film, a first metal layer, a second metal layer, a first pad, a second pad and a second protective layer. The silicon substrate is provided with a first through hole and a second through hole. The first protective layer is provided with a groove, a first communication hole and a second communication hole. The piezoelectric composite film includes a first electrode layer and a second electrode layer respectively filling the first communication hole and the first through hole, and the second communication hole and the second through hole so as to be connected to the first metal layer and the second metal layer. A surface of the second protective layer away from the piezoelectric composite film is a flat surface.

Abstract: A piezoelectric micromachined ultrasonic transducer includes a silicon substrate, a first protective layer, a supporting pillar, a piezoelectric composite film and a second protective layer. The supporting pillar is in the cavity of the first protective layer, the non-supporting pillar regions in the cavity communicates with each other. The shortest distance between a wall of the first protective layer and the supporting pillar is a first distance. The piezoelectric composite film is provided with at least two communicating holes, and the communicating holes penetrate the piezoelectric composite film and are communicated with the cavity. The second protective layer fills the two communicating holes to close the cavity. The distance between the two communicating holes is greater than twice of the first distance, and a ratio of a height of the supporting pillar to the first distance is 1/70 to 1/200, and a width of the supporting pillar is 3-10 um.