Patents by Inventor Rei Kiumi
Rei Kiumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8317993Abstract: A plating apparatus has a steam treatment chamber configured to perform a steam treatment using steam on a surface of a substrate, and a plating chamber configured to plate the surface of the substrate subjected to the steam treatment. The plating apparatus also has an acid treatment chamber configured to bring the surface of the substrate subjected to the steam treatment into contact with an acid liquid. The plating apparatus includes a frame housing the steam treatment chamber, the acid treatment chamber, and the plating chamber.Type: GrantFiled: August 18, 2009Date of Patent: November 27, 2012Assignee: Ebara CorporationInventors: Fumio Kuriyama, Rei Kiumi, Nobutoshi Saito, Takashi Takemura, Masaaki Kimura, Sachiko Takeda, Yugang Guo
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Patent number: 8252167Abstract: A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.Type: GrantFiled: December 13, 2010Date of Patent: August 28, 2012Assignee: Ebara CorporationInventors: Fumio Kuriyama, Takashi Takemura, Nobutoshi Saito, Masaaki Kimura, Rei Kiumi
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Publication number: 20110073482Abstract: A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.Type: ApplicationFiled: December 13, 2010Publication date: March 31, 2011Inventors: Fumio Kuriyama, Takashi Takemura, Nobutoshi Saito, Masaaki Kimura, Rei Kiumi
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Patent number: 7875158Abstract: A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.Type: GrantFiled: March 9, 2004Date of Patent: January 25, 2011Assignee: Ebara CorporationInventors: Fumio Kuriyama, Takashi Takemura, Nobutoshi Saito, Masaaki Kimura, Rei Kiumi
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Publication number: 20090311429Abstract: A plating apparatus has a steam treatment chamber configured to perform a steam treatment using steam on a surface of a substrate, and a plating chamber configured to plate the surface of the substrate subjected to the steam treatment. The plating apparatus also has an acid treatment chamber configured to bring the surface of the substrate subjected to the steam treatment into contact with an acid liquid. The plating apparatus includes a frame housing the steam treatment chamber, the acid treatment chamber, and the plating chamber.Type: ApplicationFiled: August 18, 2009Publication date: December 17, 2009Inventors: Fumio Kuriyama, Rei Kiumi, Nobutoshi Saito, Takashi Takemura, Masaaki Kimura, Sachiko Takeda, Yugang Guo
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Publication number: 20090218231Abstract: A plating apparatus according to the present invention has a plating tank for holding a plating solution, an anode disposed so as to be immersed in the plating solution in the plating tank, a regulation plate disposed between the anode and a plating workpiece disposed so as to face the anode, and a plating power supply for supply a current between the anode and the plating workpiece to carry out plating. The regulation plate is disposed so as to separate the plating solution held in the plating tank into a plating solution on the anode side and a plating solution on the plating workpiece side, and a through-hole group having a large number of through-holes is formed in the regulation plate.Type: ApplicationFiled: May 7, 2009Publication date: September 3, 2009Inventors: Toshikazu Yajima, Takashi Takemura, Rei Kiumi, Nobutoshi Saito, Fumio Kuriyama, Masaaki Kimura
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Publication number: 20070117365Abstract: A plating method comprising applying an ultraviolet ray to a surface of a substrate or exposing a surface of a substrate to an ozone gas or bringing a surface to a substrate into contact with ozone water or bringing a surface of a substrate into contact with electrolytic ionized water or performing a team treatment using steam on a surface of a substrate, and plating the surface of the substrate after said applying, exposing, bringing or performing process. A plating method comprising performing a team treatment using steam on a surface of a substrate, and performing a wet process on the surface of the substrate of a substrate with an acidic plating solution, cleaning the surface of the substrate with pure water and cleaning the surface of the substrate with an alkalescent aqueous solution. A plating apparatus adapted to perform at least one of said methods.Type: ApplicationFiled: September 29, 2004Publication date: May 24, 2007Applicant: EBARA CORPORATIONInventors: Fumio Kuriyama, Rei Kiumi, Nobutoshi Saito, Takashi Takemura, Masaaki Kimura, Sachiko Takeda, Yugang Guo
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Publication number: 20060113185Abstract: The present invention is concerned with a plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus (170) has a plating tank (186) for holding a plating solution (188), a holder (160) for holding a workpiece (W) and bringing a surface to be plated of the workpiece into contact with the plating solution (188) in the plating tank (186), and a ring-shaped nozzle pipe (220) disposed in the plating tank (186) and having a plurality of plating solution injection nozzles (222) for injecting the plating solution (188) to the surface to be plated of the workpiece held by the holder (160) to supply the plating solution (188) into the plating tank (186).Type: ApplicationFiled: March 9, 2004Publication date: June 1, 2006Inventors: Fumio Kuriyama, Takashi Takemura, Nobutoshi Saito, Masaaki Kimura, Rei Kiumi
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Patent number: 7012333Abstract: The present invention relates to a lead-free bump with suppressed formation of voids, obtained by reflowing a plated film of Sn—Ag solder alloy having an adjusted Ag content, and a method of forming the lead-free bump. The lead-free bump of the present invention is obtained by forming an Sn—Ag alloy film having a lower Ag content than that of an Sn—Ag eutectic composition by plating and reflowing the plated alloy film.Type: GrantFiled: December 24, 2003Date of Patent: March 14, 2006Assignee: Ebara CorporationInventors: Masashi Shimoyama, Hiroshi Yokota, Rei Kiumi, Fumio Kuriyama, Nobutoshi Saito
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Publication number: 20050279640Abstract: The present invention relates to a lead-free bump with suppressed formation of voids, obtained by reflowing a plated film of Sn—Ag solder alloy having an adjusted Ag content, and a method of forming the lead-free bump. The lead-free bump of the present invention is obtained by forming an Sn—Ag alloy film having a lower Ag content than that of an Sn—Ag eutectic composition by plating and reflowing the plated alloy film.Type: ApplicationFiled: July 29, 2005Publication date: December 22, 2005Inventors: Masashi Shimoyama, Hiroshi Yokota, Rei Kiumi, Fumio Kuriyama, Nobutoshi Saito
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Publication number: 20040262150Abstract: A plating apparatus according to the present invention has a plating tank (40) for holding a plating solution (10), an anode (56) disposed so as to be immersed in the plating solution (10) in the plating tank (40), a regulation plate (60) disposed between the anode (56) and a plating workpiece (W) disposed so as to face the anode (56), and a plating power supply (24) for supply a current between the anode (56) and the plating workpiece (W) to carry out plating. The regulation plate (60) is disposed so as to separate the plating solution (10) held in the plating tank (40) into a plating solution on the anode side and a plating solution on the plating workpiece side, and a through-hole group (68) having a large number of through-holes (66) is formed in the regulation plate (60).Type: ApplicationFiled: August 19, 2004Publication date: December 30, 2004Inventors: Toshikazu Yajima, Takashi Takemura, Rei Kiumi, Nobutoshi Saito, Fumio Kuriyama, Masaaki Kimura
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Publication number: 20040219775Abstract: The present invention relates to a lead-free bump with suppressed formation of voids, obtained by reflowing a plated film of Sn—Ag solder alloy having an adjusted Ag content, and a method of forming the lead-free bump. The lead-free bump of the present invention is obtained by forming an Sn—Ag alloy film having a lower Ag content than that of an Sn—Ag eutectic composition by plating and reflowing the plated alloy film.Type: ApplicationFiled: December 24, 2003Publication date: November 4, 2004Inventors: Masashi Shimoyama, Hiroshi Yokota, Rei Kiumi, Fumio Kuriyama, Nobutoshi Saito