Patents by Inventor Rei Oikawa
Rei Oikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11595019Abstract: An acoustic wave resonator includes: a support substrate; a piezoelectric substrate located on the support substrate; a first amorphous layer that is in contact with the support substrate and is mainly composed of one or more constituent elements of the support substrate; a second amorphous layer that is in contact with the piezoelectric substrate and the first amorphous layer, is mainly composed of one or more constituent elements of the piezoelectric substrate, and is thinner than the first amorphous layer; and a pair of comb-shaped electrodes that is located on an opposite surface of the piezoelectric substrate from the support substrate, each of the pair of comb-shaped electrodes including electrode fingers.Type: GrantFiled: April 4, 2019Date of Patent: February 28, 2023Assignee: TAIYO YUDEN CO., LTD.Inventors: Naoki Kakita, Osamu Kawachi, Rei Oikawa
-
Publication number: 20190326878Abstract: An acoustic wave resonator includes: a support substrate; a piezoelectric substrate located on the support substrate; a first amorphous layer that is in contact with the support substrate and is mainly composed of one or more constituent elements of the support substrate; a second amorphous layer that is in contact with the piezoelectric substrate and the first amorphous layer, is mainly composed of one or more constituent elements of the piezoelectric substrate, and is thinner than the first amorphous layer; and a pair of comb-shaped electrodes that is located on an opposite surface of the piezoelectric substrate from the support substrate, each of the pair of comb-shaped electrodes including electrode fingers.Type: ApplicationFiled: April 4, 2019Publication date: October 24, 2019Applicant: TAIYO YUDEN CO., LTD.Inventors: Naoki KAKITA, Osamu KAWACHI, Rei OIKAWA
-
Patent number: 10187035Abstract: An acoustic wave device includes: a piezoelectric substrate that is made of a single crystal piezoelectric material, and includes a first region including an upper surface, and a second region that is located under the first region and has a density less than a density of the first region; and an IDT located on the upper surface of the piezoelectric substrate.Type: GrantFiled: March 2, 2017Date of Patent: January 22, 2019Assignee: TAIYO YUDEN CO., LTD.Inventors: Osamu Kawachi, Rei Oikawa
-
Publication number: 20170272049Abstract: An acoustic wave device includes: a piezoelectric substrate that is made of a single crystal piezoelectric material, and includes a first region including an upper surface, and a second region that is located under the first region and has a density less than a density of the first region; and an IDT located on the upper surface of the piezoelectric substrate.Type: ApplicationFiled: March 2, 2017Publication date: September 21, 2017Applicant: TAIYO YUDEN CO., LTD.Inventors: Osamu KAWACHI, Rei OIKAWA
-
Patent number: 5930894Abstract: A laminated-type evaporator for an automotive air conditioning refrigerant circuit includes a plurality of tube units having a pair of tray-shaped plates. Each of the tray-shaped plates includes a depression defined therein, a flange extending about the periphery thereof, and a wall disposed at an intermediate location therein and extending a portion of the length of each plate to thereby define a rear side and a front side to each plate. The wall includes a flat portion formed at an upper end thereof. A slit is formed at the flat, upper end portion of the wall by shearing. The slit extends along substantially the entire length of the wall along the wall's longitudinal axis.Type: GrantFiled: May 13, 1997Date of Patent: August 3, 1999Assignee: Sanden CorporationInventors: Rei Oikawa, Yukihiro Fukada
-
Patent number: 5806587Abstract: A heat exchanger is provided with a first tank and a second tank. Heat transfer tubes are disposed between the tanks and are connected to the tanks to place the tanks in fluid communication. At least one of the tanks is divided into chambers by a partition. A reinforcement plate member is disposed in at least one of the first and the second tanks for reinforcing the tank to prevent deformation of the tank due to an increase of the pressure within the tanks. The reinforcement plate member is not connected to the partition.Type: GrantFiled: July 25, 1996Date of Patent: September 15, 1998Assignee: Sanden CorporationInventors: Kenichi Sasaki, Rei Oikawa, Tomohiro Chiba, Jun Iwai
-
Patent number: 5718285Abstract: A laminated-type evaporator for an automotive air conditioning refrigerant circuit includes a plurality of tube units having a pair of tray-shaped plates. Each of the tray-shaped plates includes a depression defined therein, a flange extending about the periphery thereof, and a wall disposed at an intermediate location therein and extending a portion of the length of each plate to thereby define a rear side and a front side to each plate. The wall includes a flat portion formed at an upper end thereof. A slit is formed at the flat, upper end portion of the wall by shearing. The slit extends along substantially the entire length of the wall along the wall's longitudinal axis.Type: GrantFiled: February 2, 1996Date of Patent: February 17, 1998Assignee: Sanden CorporationInventors: Rei Oikawa, Yukihiro Fukada
-
Patent number: 5590710Abstract: A heat exchanger is provided with a first tank and a second tank. Heat transfer tubes are disposed between the tanks and are connected to the tanks to place the tanks in fluid communication. At least one of the tanks is divided into chambers by a partition. A reinforcement plate member is disposed in at least one of the first and the second tanks for reinforcing the tank to prevent deformation of the tank due to an increase of the pressure within the tanks. The reinforcement plate member is not connected to the partition.Type: GrantFiled: December 21, 1994Date of Patent: January 7, 1997Assignee: Sanden CorporationInventors: Kenichi Sasaki, Rei Oikawa, Tomohiro Chiba, Jun Iwai
-
Patent number: 5540278Abstract: A heat exchanger includes upper and lower tanks, a plurality of parallel heat transfer tubes fluidly interconnected between the upper and lower tanks, a plurality of reinforcing members connecting an upper wall and a lower wall of the upper and lower tanks, and a communication path associated with each reinforcing member. The reinforcing members increase the strength of the tank walls against deformation due to the high pressure working fluid without increasing the thickness of the walls or increasing the spacing between the tubes. The communication path ensures efficient flow of a heat medium in the tanks.Type: GrantFiled: June 1, 1995Date of Patent: July 30, 1996Assignee: Sanden CorporationInventors: Tomohiro Chiba, Hisao Aoki, Rei Oikawa