Patents by Inventor Rei YONEYAMA

Rei YONEYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR MODULE
    Publication number: 20130161644
    Abstract: Provided is a semiconductor module having high inrush-current tolerance. A semiconductor module includes a switching element formed of a wide bandgap semiconductor, and a free wheel diode connected in antiparallel with the switching element, wherein the free wheel diode is made of silicon and has negative temperature characteristics.
    Type: Application
    Filed: August 31, 2012
    Publication date: June 27, 2013
    Applicant: Mitsubishi Electric Corporation
    Inventors: Rei YONEYAMA, Hiroyuki OKABE, Takahiro INOUE, Shinji SAKAI