Patents by Inventor Reid A. Black

Reid A. Black has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for forming thin bulk junction thermoelectric devices in package
    Patent number: 11502236
    Abstract: This disclosure relates to an integrated thermoelectric cooler and methods for forming thereof. The integrated thermoelectric cooler can include a plurality of thermoelectric rods located between the detector substrate and a system interposer. The detector substrate and the system interposer can directly contact ends of the thermoelectric rods. The integrated thermoelectric cooler can be formed by forming the plurality of thermoelectric rods on reels, for example, and the plurality of thermoelectric rods can be thinned down to a certain height. The thermoelectric rods can be transferred and bonded to the system substrate. An overmold can be formed around the plurality of thermoelectric rods. The height of the overmold and thermoelectric rods can be thinned down to another height. The thermoelectric rods can be bonded to the detector substrate. In some examples, the overmold can be removed.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: November 15, 2022
    Assignee: Apple Inc.
    Inventors: Michael J. Bishop, Gregory L. Tice, Mario J. Costello, Reid A. Black, Vijay M. Iyer
  • Systems and methods for forming thin bulk junction thermoelectric devices in package
    Patent number: 10964873
    Abstract: This disclosure relates to an integrated thermoelectric cooler and methods for forming thereof. The integrated thermoelectric cooler can include a plurality of thermoelectric rods located between the detector substrate and a system interposer. The detector substrate and the system interposer can directly contact ends of the thermoelectric rods. The integrated thermoelectric cooler can be formed by forming the plurality of thermoelectric rods on reels, for example, and the plurality of thermoelectric rods can be thinned down to a certain height. The thermoelectric rods can be transferred and bonded to the system substrate. An overmold can be formed around the plurality of thermoelectric rods. The height of the overmold and thermoelectric rods can be thinned down to another height. The thermoelectric rods can be bonded to the detector substrate. In some examples, the overmold can be removed.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: March 30, 2021
    Assignee: Apple Inc.
    Inventors: Michael J. Bishop, Gregory L. Tice, Mario J. Costello, Reid A. Black, Vijay M. Iyer