Abstract: A ceramic chip-resistant chamfered integrated circuit package and an apparatus for and method of manufacture thereof. The exposed-surface edge of each short end of a ceramic package component (base and/or cap) are made with an integral chamfer at an angle of from about 20.degree. to about 85.degree. relative to the plane of the opposing inner surface of the component. The height H of the chamfer is from about 20% to about 67% of the thickness T of the ceramic package component. In particular, the preferred angle of the chamfer is from about 50.degree. to about 70.degree., with a preferred height H of about 30% to about 50% of the thickness T. The integral chamfer of each ceramic package component is made by means of an inventive die-press apparatus for inverted formation of the ceramic package component. The inventive method forms the chamfers without causing localized compaction of the ceramic powder starting material.

Abstract: A ceramic chip-resistant chamfered integrated circuit package and an apparatus for and method of manufacture thereof. The exposed-surface edge of each short end of a ceramic package component (base and/or cap) are made with an integral chamfer at an angle of from about 20.degree. to about 85.degree. relative to the plane of the opposing inner surface of the component. The height H of the chamfer is from about 20% to about 67% of the thickness T of the ceramic package component. In particular, the preferred angle of the chamfer is from about 50.degree. to about 70.degree., with a preferred height H of about 30% to about 50% of the thickness T. The integral chamfer of each ceramic package component is made by means of an inventive die-press apparatus for inverted formation of the ceramic package component. The inventive method forms the chamfers without causing localized compaction of the ceramic powder starting material.