Abstract: A solid-state imaging device comprises a CMOS sensor, a circuit board, a ceramic plate, an IR cut filter, a taking lens, a lens holder, and a support barrel. The CMOS sensor is mounted on the circuit board. The circuit board is fixed to the ceramic plate such that the CMOS sensor is placed inside an opening of the ceramic plate. The sides of the CMOS sensor are surrounded by the ceramic plate. The IR cut filter is fixed to the ceramic plate so as to cover the opening. The CMOS sensor is disposed behind the taking lens. The IR cut filter is disposed between the taking lens and the CMOS sensor. A light-shielding layer is formed over the entire periphery of edge portions of an incident surface of the IR cut filter. Harmful rays such as reflective light is blocked by the light-shielding layer.

Abstract: In a shift lever device, at a time when a shift lever is pivotally operated in a front-rear direction, a retainer and a link are pivoted integrally with the shift lever, and a pivot portion is pivoted in the front-rear direction. Further, at a time when the shift lever is pivotally operated in a left-right direction, the shift lever is pivoted with respect to the retainer, and the link is pivoted, and the pivot portion is thereby pivoted in the left-right direction. Moreover, a position of the pivot portion is detected by a detecting mechanism, and a shift position of the shift lever is detected. Therefore, the shift position of the shift lever can be detected via the link.

Abstract: A solid-state imaging device comprises an image sensor, a circuit board, a support plate, an IR cut filter, a taking lens, a lens holder, and a support barrel. The image sensor is mounted on the circuit board. The circuit board is fixed to the support plate with the image sensor placed inside an opening of a plate body of the support plate. The sides of the image sensor are surrounded by the support plate. The IR cut filter is fixed to the support plate so as to cover the opening. The image sensor is disposed on an exit surface side of the taking lens. The IR cut filter is disposed between the taking lens and the image sensor. A light-shielding layer is formed over entire periphery of an inner wall of the plate body. Harmful rays are blocked by the light-shielding layer.

Abstract: There is provided a conductive film laminate used in a touch panel, including: a first pressure sensitive adhesive layer; a first conductive layer; a substrate; a second conductive layer; and a second pressure sensitive adhesive layer, in this order, in which a total moisture content of the substrate, the first pressure sensitive adhesive layer, and the second pressure sensitive adhesive layer is 1.0 g/m2 or less. There are provided a conductive film laminate, in which, even in a severe environment of high temperature and high humidity, a change of electrostatic capacitance between two layers of conductive films is small, high sensitivity can be maintained, and thus operation failure or malfunction can be prevented, and a touch panel using this conductive film laminate.

Abstract: In a shift lever device, at a time when a shift lever is pivotally operated in a front-rear direction, a retainer and a link are pivoted integrally with the shift lever, and a pivot portion is pivoted in the front-rear direction. Further, at a time when the shift lever is pivotally operated in a left-right direction, the shift lever is pivoted with respect to the retainer, and the link is pivoted, and the pivot portion is thereby pivoted in the left-right direction. Moreover, a position of the pivot portion is detected by a detecting mechanism, and a shift position of the shift lever is detected. Therefore, the shift position of the shift lever can be detected via the link.

Abstract: A laminate for a touch panel suppresses false operation through a wide range of temperatures. A flat panel display includes the laminate. The laminate includes an adhesive layer, and a capacitance touch panel sensor, in which the adhesive layer includes a poly(meth)acrylate which is formed by polymerizing (meth)acrylate and which has a polycyclic aliphatic hydrocarbon group and a saturated chain hydrocarbon group, the (meth)acrylate compound includes at least one type or 2 or more types of (meth)acrylate X which is represented by Formula (X) and which has a polycyclic aliphatic hydrocarbon group with 7 to 30 carbon atoms and one type or 2 or more types of (meth)acrylate Y which is represented by Formula (Y) and which has a saturated chain hydrocarbon group with 8 to 30 carbon atoms, and a temperature dependency of relative permittivity of the adhesive layer and a maximum value of relative permittivity are predetermined values.

Abstract: Provided is a laminate for a touch panel that is a laminate that is used in a touch panel, and that can prevent migration of wiring caused by incursion of moisture. The laminate for a touch panel includes a substrate; wiring that is formed on a surface of the substrate; and an adhesive layer that is in contact with the wiring and is provided on the substrate, in which moisture permeability of the adhesive layer is 40 g/(m2·day) or less, and a shortest distance from an end surface to the wiring is 500 ?m or greater.

Abstract: A solid-state imaging device comprises an image sensor, a circuit board, a support plate, an IR cut filter, a taking lens, a lens holder, and a support barrel. The image sensor is mounted on the circuit board. The circuit board is fixed to the support plate with the image sensor placed inside an opening of a plate body of the support plate. The sides of the image sensor are surrounded by the support plate. The IR cut filter is fixed to the support plate so as to cover the opening. The image sensor is disposed on an exit surface side of the taking lens. The IR cut filter is disposed between the taking lens and the image sensor. A light-shielding layer is formed over entire periphery of an inner wall of the plate body. Harmful rays are blocked by the light-shielding layer.

Abstract: A solid-state imaging device comprises a CMOS sensor, a circuit board, a ceramic plate, an IR cut filter, a taking lens, a lens holder, and a support barrel. The CMOS sensor is mounted on the circuit board. The circuit board is fixed to the ceramic plate such that the CMOS sensor is placed inside an opening of the ceramic plate. The sides of the CMOS sensor are surrounded by the ceramic plate. The IR cut filter is fixed to the ceramic plate so as to cover the opening. The CMOS sensor is disposed behind the taking lens. The IR cut filter is disposed between the taking lens and the CMOS sensor. A light-shielding layer is formed over the entire periphery of edge portions of an incident surface of the IR cut filter. Harmful rays such as reflective light is blocked by the light-shielding layer.

Abstract: In a strength gate of a shift lever device, a shift hole is provided with an automatic transmission hole, a manual transmission hole, and a communication hole. The strength gate is provided with a peninsular portion that is adjacent to the automatic transmission hole, the manual transmission hole and the communication hole, and an opposing portion that is on the opposite side of the manual transmission hole to the peninsular portion. The peninsular portion is disposed to a front side with respect to the opposing portion. A reduction in the size of the peninsular portion along the vehicle left-right direction can accordingly be suppressed even if the strength gate is reduced in size along the vehicle left-right direction, thereby enabling a reduction in the strength of the peninsular portion to be suppressed.

Abstract: In a shift lever device, a first engagement portion or a second engagement portion of a shift lever is inserted into a first stopping hole or a second stopping hole of a strength gate when the shift lever is turned along a manual transmission hole, thereby stopping the shift lever from turning towards an automatic transmission hole side. In the shift lever, the first engagement portion and the second engagement portion are disposed at the vehicle front side and the vehicle rear side of a support body. An increase in size of the shift lever in the vehicle left-right direction due to the first engagement portion and the second engagement portion can accordingly be suppressed, and the turning rage of the shift lever in the vehicle left-right direction can be made smaller, thereby enabling a reduction in size of the shift lever device in the vehicle left-right direction.

Abstract: In a shift lever device, a first engagement portion or a second engagement portion of a shift lever is inserted into a first stopping hole or a second stopping hole of a strength gate when the shift lever is turned along a manual transmission hole, thereby stopping the shift lever from turning towards an automatic transmission hole side. In the shift lever, the first engagement portion and the second engagement portion are disposed at the vehicle front side and the vehicle rear side of a support body. An increase in size of the shift lever in the vehicle left-right direction due to the first engagement portion and the second engagement portion can accordingly be suppressed, and the turning rage of the shift lever in the vehicle left-right direction can be made smaller, thereby enabling a reduction in size of the shift lever device in the vehicle left-right direction.

Abstract: In a strength gate of a shift lever device, a shift hole is provided with an automatic transmission hole, a manual transmission hole, and a communication hole. The strength gate is provided with a peninsular portion that is adjacent to the automatic transmission hole, the manual transmission hole and the communication hole, and an opposing portion that is on the opposite side of the manual transmission hole to the peninsular portion. The peninsular portion is disposed to a front side with respect to the opposing portion. A reduction in the size of the peninsular portion along the vehicle left-right direction can accordingly be suppressed even if the strength gate is reduced in size along the vehicle left-right direction, thereby enabling a reduction in the strength of the peninsular portion to be suppressed.

Abstract: A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.

Abstract: A key includes a body that is plate-shaped to be inserted into a locking device, and a groove that is formed in the body and engages with a plurality of tumblers of the locking device to allow locking and unlocking operations. The groove includes, at a location corresponding to one tumbler of the locking device, a non-engagement part that does not engage with the one tumbler. The groove may include an inside groove, and the non-engagement part may include a notch portion that the inside groove is cut to reach an edge portion of the body.

Abstract: A key includes a body that is plate-shaped to be inserted into a locking device, and a groove that is formed in the body and engages with a plurality of tumblers of the locking device to allow locking and unlocking operations. The groove includes, at a location corresponding to one tumbler of the locking device, a non-engagement part that does not engage with the one tumbler. The groove may include an inside groove, and the non-engagement part may include a notch portion that the inside groove is cut to reach an edge portion of the body.

Abstract: The present invention provides a printed wiring board free from undercuts, which can be formed by an additive method without a dry treatment and a dry treatment apparatus, and a production method thereof. A printed wiring board of the present invention has a conductor circuit free from undercuts which is produced by carrying out additional plating to fill undercuts.

Abstract: A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.

Abstract: A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.

Abstract: A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion 114b of the through hole 114 is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion 114a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112a of the conductive layer 112.