Patents by Inventor Reiji Yoshimura

Reiji Yoshimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9828250
    Abstract: [Problems] To provide a method of preventing the polysilicon from being contaminated with metals by providing a resin cover on the surface of a metal substrate that comes in contact with the polysilicon, wherein the metal surfaces are reliably prevented from being exposed that is caused by the wear of the cover. [Means for Solution] A method of preventing the polysilicon from being contaminated with metals caused by the contact of the polysilicon with a metal substrate by providing a resin cover on the surface of the metal substrate, wherein the resin cover 3 comprises two kinds of resin sheets 3a and 3b overlapped one upon the other.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: November 28, 2017
    Assignee: TOKUYAMA CORPORATION
    Inventors: Manabu Kondou, Reiji Yoshimura
  • Publication number: 20120156413
    Abstract: [Problems] To provide a method of preventing the polysilicon from being contaminated with metals by providing a resin cover on the surface of a metal substrate that comes in contact with the polysilicon, wherein the metal surfaces are reliably prevented from being exposed that is caused by the wear of the cover. [Means for Solution] A method of preventing the polysilicon from being contaminated with metals caused by the contact of the polysilicon with a metal substrate by providing a resin cover on the surface of the metal substrate, wherein the resin cover 3 comprises two kinds of resin sheets 3a and 3b overlapped one upon the other.
    Type: Application
    Filed: September 17, 2010
    Publication date: June 21, 2012
    Inventors: Manabu Kondou, Reiji Yoshimura