Abstract: A photosensitive resin composition for use in forming a relief structure, which comprises, in specific proportions, a liquid photosensitive resin component comprising a urethane prepolymer and an addition-polymerizable ethylenically unsaturated monomer; a photopolymerization initiator; a thermal polymerization inhibitor; and a specific unsaturated amine compound. The photosensitive resin composition exhibits excellent performances such that it does not suffer from tunnel phenomenon which is frequently observed in relief formation with respect to conventional photosensitive resin compositions, so that a photoresin relief structure made therefrom not only is characterized with a tunnel-free structure and excellent mechanical properties, but also exhibits excellent performances.

Abstract: A photosensitive resin composition which is improved with respect to surface tack-free characteristic after curing by exposure to actinic radiation is disclosed. Further, there is disclosed a method of preparing a surface-tack free photocured pattern structure using the photosensitive resin composition, which enables pattern structures improved with respect to surface tack-free characteristic to be obtained in a shortened period of time.