Patents by Inventor Reijo RAUTAKOSKI

Reijo RAUTAKOSKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220248576
    Abstract: This disclosure describes an electronic component comprising a package base and a metallic cap. The metallic cap separates the enclosure into at least a first compartment and a second compartment. An electronic chip is in the first compartment, and the metallic cap separates the enclosure into the first and second compartments with its shape which forms a separator which extends from the ceiling of the first compartment toward the mounting plane of the electronic chip.
    Type: Application
    Filed: January 10, 2022
    Publication date: August 4, 2022
    Inventors: Teppo SYRJÄNEN, Ville-Pekka RYTKÖNEN, Reijo RAUTAKOSKI