Patents by Inventor Reika Satsurai

Reika Satsurai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-zinc chloride type flux for tin plating
    Patent number: 5798000
    Abstract: A non-zinc chloride type flux applied for use in plating a substrate metal member with molten tin, containing at least one chemical compound selected from the group of stannous chloride, sodium chloride, potassium chloride and ammonium chloride and excluding zinc chloride therefrom. The flux is floated on the surface of molten tin in the plating process or used in a condition of solution before the substrate metal member is plated with molten tin.
    Type: Grant
    Filed: January 29, 1997
    Date of Patent: August 25, 1998
    Assignee: Hoshizaki Denki Kabushiki Kaisha
    Inventor: Reika Satsurai
  • Flux for soldering
    Patent number: 5584942
    Abstract: A flux applied in soldering to a substrate metal formed thereon with a firmly oxidized layer, the flux containing at least stannous chloride, non-oxidation acid and a viscous agent and excluding zinc chloride therefrom.
    Type: Grant
    Filed: May 31, 1994
    Date of Patent: December 17, 1996
    Assignee: Hoshizaki Denki Kabushiki Kaisha
    Inventor: Reika Satsurai