Patents by Inventor Reiko Fujiwara

Reiko Fujiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 7928551
    Abstract: In a semiconductor device, a first semiconductor chip is stacked on a wiring substrate and has first electrode pads disposed at predetermined positions on an upper surface thereof. A second semiconductor chip is stacked on the first semiconductor chip through an insulating member in an offset manner so that the first electrode pads are exposed. Support members support a back surface of a protruding portion of the second semiconductor chip through the insulating member.
    Type: Grant
    Filed: October 15, 2008
    Date of Patent: April 19, 2011
    Assignee: Elpida Memory, Inc.
    Inventors: Reiko Fujiwara, Akihiko Hatasawa, Fumitomo Watanabe
  • Semiconductor device and method of manufacturing the same
    Publication number: 20090096111
    Abstract: In a semiconductor device, a first semiconductor chip is stacked on a wiring substrate and has first electrode pads disposed at predetermined positions on an upper surface thereof. A second semiconductor chip is stacked on the first semiconductor chip through an insulating member in an offset manner so that the first electrode pads are exposed. Support members support a back surface of a protruding portion of the second semiconductor chip through the insulating member.
    Type: Application
    Filed: October 15, 2008
    Publication date: April 16, 2009
    Applicant: Elpida Memory, Inc.
    Inventors: Reiko Fujiwara, Akihiko Hatasawa, Fumitomo Watanabe