Patents by Inventor Reiko Izumi

Reiko Izumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200098790
    Abstract: A memory device includes first electrode layers stacked in a first direction, a first semiconductor layer piercing the first electrode layers in a first direction, a first insulating film surrounding the first semiconductor layer, and a semiconductor base connected to the first semiconductor layer. The first insulating film includes a first film, a second film, and a third film provided in order in a second direction from the first semiconductor layer toward one of first electrode layers. Spacing in the first direction between the second film and the semiconductor base is wider than a film thickness of the third film in the second direction. A minimum width of an outer perimeter of the first semiconductor layer is substantially the same as a width of an outer perimeter at a portion of the first semiconductor layer piercing the most proximal first electrode layer.
    Type: Application
    Filed: November 26, 2019
    Publication date: March 26, 2020
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Reiko KOMIYA, Tatsuo IZUMI, Takaya YAMANAKA, Takeshi NAGATOMO, Karin TAKAGI
  • Patent number: 10546670
    Abstract: This insulated wire includes an insulating coating formed on a surface of a conductive wire body, and a soldered portion for electric conduction. The soldered portion is formed by attaching dicarboxylic acid onto a surface of the insulating coating, and by performing solder plating in a state where the dicarboxylic acid is attached onto the surface of the insulating coating. In addition, this method for manufacturing an insulated wire includes a surface treatment step of attaching the dicarboxylic acid onto a surface of an insulating coating which becomes the soldered portion, and a soldering step of performing the solder plating by immersing the surface treated portion of the insulating coating in a heated solder melt.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: January 28, 2020
    Assignee: Mitsubishi Materials Corporation
    Inventors: Reiko Izumi, Shintaro Iida, Hideaki Sakurai, Takeshi Ikeda, Ken Hayashii
  • Patent number: 10529735
    Abstract: A memory device includes first electrode layers stacked in a first direction, a first semiconductor layer piercing the first electrode layers in a first direction, a first insulating film surrounding the first semiconductor layer, and a semiconductor base connected to the first semiconductor layer. The first insulating film includes a first film, a second film, and a third film provided in order in a second direction from the first semiconductor layer toward one of first electrode layers. Spacing in the first direction between the second film and the semiconductor base is wider than a film thickness of the third film in the second direction. A minimum width of an outer perimeter of the first semiconductor layer is substantially the same as a width of an outer perimeter at a portion of the first semiconductor layer piercing the most proximal first electrode layer.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: January 7, 2020
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Reiko Komiya, Tatsuo Izumi, Takaya Yamanaka, Takeshi Nagatomo, Karin Takagi
  • Patent number: 10431311
    Abstract: According to one embodiment, a semiconductor memory includes includes conductors, a pillar through the conductors, a controller. The pillar includes a first pillar portion, a second pillar portion, and a joint portion between the first pillar portion and the second pillar portion. Each of the portions where the pillar and the conductors cross functions as a transistor. Among the conductors through the first pillar portion, the conductor most proximal to the joint portion and one of the other conductors respectively function as a first dummy word line and a first word line. Among the conductors through the second pillar portion, the conductor most proximal to the joint portion and one of the other conductors respectively function as a second dummy word line and a second word line.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: October 1, 2019
    Assignee: Toshiba Memory Corporation
    Inventors: Tatsuo Izumi, Reiko Komiya
  • Publication number: 20190287997
    Abstract: A memory device includes first electrode layers stacked in a first direction, a first semiconductor layer piercing the first electrode layers in a first direction, a first insulating film surrounding the first semiconductor layer, and a semiconductor base connected to the first semiconductor layer. The first insulating film includes a first film, a second film, and a third film provided in order in a second direction from the first semiconductor layer toward one of first electrode layers. Spacing in the first direction between the second film and the semiconductor base is wider than a film thickness of the third film in the second direction. A minimum width of an outer perimeter of the first semiconductor layer is substantially the same as a width of an outer perimeter at a portion of the first semiconductor layer piercing the most proximal first electrode layer.
    Type: Application
    Filed: September 11, 2018
    Publication date: September 19, 2019
    Applicant: Toshiba Memory Corporation
    Inventors: Reiko Komiya, Tatsuo Izumi, Takaya Yamanaka, Takeshi Nagatomo, Karin Takagi
  • Patent number: 10395798
    Abstract: The present invention provides an insulated wire having a heat-resistant insulating layer, wherein heat-resistant particles are contained in the insulating layer, and the heat-resistant particles are densely dispersed in a surface region of the insulating layer. For example, the concentration of heat-resistant particles included in a layer thick portion of 0.5 ?m from the surface of the insulating layer is two times the concentration of heat-resistant particles included in a central portion of the insulating layer. An electrodeposition liquid used to form the insulating layer is formed by dispersing the heat-resistant particles in a suspension in which resin particles are dispersed, the viscosity is 100 cP or less, and the turbidity is 1 mg/L or more.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: August 27, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro Iida, Reiko Izumi, Hideaki Sakurai, Ken Hayashii, Keiko Ashida
  • Publication number: 20190214405
    Abstract: According to one embodiment, the stacked body includes a first stacked portion including a plurality of electrode layers, a second stacked portion including a plurality of electrode layers, and being disposed separately from the first stacked portion in the first direction, and a connection portion including a high dielectric layer provided between the first stacked portion and the second stacked portion and having a dielectric constant higher than a dielectric constant of the insulator. The column-shaped portion includes a first portion provided in the first stacked portion and extending in the first direction of the stacked body, a second portion provided in the second stacked portion and extending in the first direction, and an intermediate portion provided in the connection portion and connected the first portion to the second portion.
    Type: Application
    Filed: March 13, 2019
    Publication date: July 11, 2019
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Kaito SHIRAI, Hideto Takekida, Tatsuo Izumi, Reiko Shamoto, Takahisa Kanemura, Shigeo Kondo
  • Publication number: 20190189218
    Abstract: According to one embodiment, a semiconductor memory includes includes conductors, a pillar through the conductors, a controller. The pillar includes a first pillar portion, a second pillar portion, and a joint portion between the first pillar portion and the second pillar portion. Each of the portions where the pillar and the conductors cross functions as a transistor. Among the conductors through the first pillar portion, the conductor most proximal to the joint portion and one of the other conductors respectively function as a first dummy word line and a first word line. Among the conductors through the second pillar portion, the conductor most proximal to the joint portion and one of the other conductors respectively function as a second dummy word line and a second word line.
    Type: Application
    Filed: August 7, 2018
    Publication date: June 20, 2019
    Applicant: Toshiba Memory Corporation
    Inventors: Tatsuo IZUMI, Reiko KOMIYA
  • Publication number: 20180366241
    Abstract: The present invention provides an insulated wire having a heat-resistant insulating layer, wherein heat-resistant particles are contained in the insulating layer, and the heat-resistant particles are densely dispersed in a surface region of the insulating layer. For example, the concentration of heat-resistant particles included in a layer thick portion of 0.5 ?m from the surface of the insulating layer is two times the concentration of heat-resistant particles included in a central portion of the insulating layer. An electrodeposition liquid used to form the insulating layer is formed by dispersing the heat-resistant particles in a suspension in which resin particles are dispersed, the viscosity is 100 cP or less, and the turbidity is 1 mg/L or more.
    Type: Application
    Filed: December 16, 2015
    Publication date: December 20, 2018
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro IIDA, Reiko IZUMI, Hideaki SAKURAI, Ken HAYASHII, Keiko ASHIDA
  • Publication number: 20170278595
    Abstract: This insulated wire includes an insulating coating formed on a surface of a conductive wire body, and a soldered portion for electric conduction. The soldered portion is formed by attaching dicarboxylic acid onto a surface of the insulating coating, and by performing solder plating in a state where the dicarboxylic acid is attached onto the surface of the insulating coating. In addition, this method for manufacturing an insulated wire includes a surface treatment step of attaching the dicarboxylic acid onto a surface of an insulating coating which becomes the soldered portion, and a soldering step of performing the solder plating by immersing the surface treated portion of the insulating coating in a heated solder melt.
    Type: Application
    Filed: September 28, 2015
    Publication date: September 28, 2017
    Applicants: Mitsubishi Materials Corporation, Mitsubishi Cable Industries, Ltd.
    Inventors: Reiko IZUMI, Shintaro IIDA, Hideaki SAKURAI, Takeshi IKEDA, Ken HAYASHII
  • Patent number: 9647185
    Abstract: A light emitting element having a light emitting layer, an electro-conductive reflection film that reflects light emitted from the light emitting layer and a substrate in this order, wherein the electro-conductive reflection film contains metal nanoparticles.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: May 9, 2017
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fuyumi Mawatari, Youji Kondou, Reiko Izumi, Yoshimasa Hayashi, Kazuhiko Yamasaki
  • Publication number: 20130234191
    Abstract: A light emitting element having a light emitting layer, an electro-conductive reflection film that reflects light emitted from the light emitting layer and a substrate in this order, wherein the electro-conductive reflection film contains metal nanoparticles.
    Type: Application
    Filed: November 10, 2011
    Publication date: September 12, 2013
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fuyumi Mawatari, Youji Kondou, Reiko Izumi, Yoshimasa Hayashi, Kazuhiko Yamasaki
  • Publication number: 20130174904
    Abstract: This composition for an antireflective film includes a translucent binder, wherein the translucent binder contains either one or both of a polymer type binder and a non-polymer type binder, a content of the translucent binder is in a range of 10 parts by mass to 90 parts by mass with respect to 100 parts by mass of a total amount of components other than a dispersion medium, and a refractive index of an antireflective film which is formed by curing the composition for an antireflective film is in a range of 1.70 to 1.90. This method for manufacturing an antireflective film includes: applying the above-described composition for an antireflective film onto a transparent conductive film by a wet coating method to form an antireflective coating film; and curing the antireflective coating film to form an antireflective film.
    Type: Application
    Filed: September 29, 2011
    Publication date: July 11, 2013
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazuhiko Yamasaki, Satoko Higano, Reiko Izumi, Toshiharu Hayashi
  • Patent number: 7794853
    Abstract: Porous titanium having a low contact resistance includes porous titanium body, Au, and Ti oxide layer (3). Porous titanium includes continuous holes (1) opening on a surface and being connected to inner holes and a skeleton (2). Au adheres to at least an outer skeletal surface (4) of the porous titanium via diffusion bonding to form a network structure. The Ti oxide layer (3) is formed in a clearance between adjacent Au cords (5) of the Au network sticking. The width of an Au cord (5) of the Au network is 0.3 to 10 ?m at least at one position; and the thickness of the Ti oxide layer (3), which is formed in the clearance between adjacent Au cords (5) of the Au network is 30 to 150 nm.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: September 14, 2010
    Assignee: Mitsubishi Materials Corporation
    Inventors: Kenji Orito, Toshiharu Hayashi, Masahiro Wada, Reiko Izumi, Koji Hoshino
  • Publication number: 20100015507
    Abstract: Porous titanium having a low contact resistance includes porous titanium body, Au, and a Ti oxide layer (3). Porous titanium includes continuous holes (1) opening on a surface and being connected to inner holes and a skeleton (2). Au adheres to at least an outer skeletal surface (4) of the porous titanium via diffusion bonding to form a network structure. The Ti oxide layer (3) is formed in a clearance between adjacent Au codes (5) of the Au network sticking. The width of an Au code (5) of the Au network is 0.3 to 10 ?m at least at one position; and the thickness of the Ti oxide layer (3), which is formed in the clearance between adjacent Au codes (5) of the Au network is 30 to 150 nm.
    Type: Application
    Filed: December 13, 2007
    Publication date: January 21, 2010
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenji Orito, Toshiharu Hayashi, Masahiro Wada, Reiko Izumi, Koji Hoshino
  • Publication number: 20080293818
    Abstract: A regulator for regulating physiological functions, such as activity of increasing an intracellular calcium ion concentration, activity of promoting growth hormone secretion, activity of promoting eating, regulatory activity relating to fat accumulation, activity of ameliorating heart function and activity of stimulating gastric acid secretion, of ghrelin, which regulator comprises a fatty acid of carbon number 2-35 or its derivative, and use thereof.
    Type: Application
    Filed: April 19, 2005
    Publication date: November 27, 2008
    Inventors: Masayasu Kojima, Yoshihiro Nishi, Kenji Kanagawa, Keiichi Abe, Reiko Izumi, Junichi Nakamura
  • Patent number: 4933182
    Abstract: A pharmaceutical composition for treating periodontal diseases which comprises one or more of therapeutically active ingredients dispersed in a carrier, characterized in that said carrier consists of(A) water soluble polymer, and(B) polymeric particles having a limited solubility in water,said particles being dispersed in said water soluble polymer.
    Type: Grant
    Filed: September 29, 1989
    Date of Patent: June 12, 1990
    Assignee: Rohto Pharmaceutical Co. Ltd.
    Inventors: Kiyotsugu Higashi, Shigeru Kametaka, Reiko Izumi, Katsuhiko Morisaki, Shin'ichi Hayashi
  • Patent number: 4906670
    Abstract: A pharmaceutical composition useful for treatment of periodontal diseases which comprises one or more active ingredients effective for the treatment of periodontal diseases, characterized in that said active ingredient or ingredients are dispersed in collagen.
    Type: Grant
    Filed: March 1, 1989
    Date of Patent: March 6, 1990
    Assignee: Rohto Pharmaceutical Co., Ltd.
    Inventors: Kiyotsugu Higashi, Shigeru Kametaka, Reiko Izumi, Katsuhiko Morisaki, Shin'ichi Hayashi
  • Patent number: D426150
    Type: Grant
    Filed: July 6, 1998
    Date of Patent: June 6, 2000
    Assignee: Suntory Limited
    Inventors: Reiko Izumi, Hiroyuki Ono