Patents by Inventor Reiko Kiyoshima

Reiko Kiyoshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8709296
    Abstract: With respect to the metal colloid of the present invention, metal colloidal particles capable of forming a metal colloid by dispersing in either or both of an aqueous dispersion medium and a nonaqueous dispersion medium in a predetermined proportion while mixing, comprise metal particles and a protective agent coordination-modified on the surface of the particles, the protective agent having a carbon skeleton containing either or both of sulfur and oxygen in the molecule, and having a structure of being coordination-modified on the surface of the metal particles using an atom or an atomic group of either or both of sulfur and oxygen as an anchor, wherein the protective agent has one, or two or more functional groups selected from the group consisting of alkoxysilyl group, silanol group and hydroxyalkyl group in a molecular structure.
    Type: Grant
    Filed: June 22, 2005
    Date of Patent: April 29, 2014
    Assignees: Mitsubishi Materials Corporation, Mitsubishi Materials Electronic Chemicals Co., Ltd.
    Inventors: Reiko Kiyoshima, Toshiharu Hayashi
  • Patent number: 7628840
    Abstract: Each of the metal nano-particles present in a dispersion, which comprises at least one metal selected from the group consisting of precious metals and transition metals or an alloy of at least two metals selected from the foregoing metals, comprises a metal particle in which an organic metal compound of a fatty acid and/or an amine-metal complex is adhered to the periphery of the metal particle. This organic metal compound and the amine-metal complex are admixed together in a solvent and then the resulting mixture is subjected to a reducing treatment to thus form a dispersion containing metal nano-particles in a concentration of not less than 5% by mass and not more than 90% by mass. The resulting dispersion is applied onto the surface of a base material, followed by drying the applied layer of the dispersion and then firing the dried layer of the dispersion at a low temperature to thus form a thin metallic wire or a metal film having conductivity.
    Type: Grant
    Filed: September 7, 2004
    Date of Patent: December 8, 2009
    Assignees: ULVAC, Inc., JEMCO, Inc.
    Inventors: Tsutomu Atsuki, Masaaki Oda, Toshiharu Hayashi, Reiko Kiyoshima
  • Publication number: 20080277630
    Abstract: With respect to the metal colloid of the present invention, metal colloidal particles capable of forming a metal colloid by dispersing in either or both of an aqueous dispersion medium and a nonaqueous dispersion medium in a predetermined proportion while mixing, comprise metal particles and a protective agent coordination-modified on the surface of the particles, the protective agent having a carbon skeleton containing either or both of sulfur and oxygen in the molecule, and having a structure of being coordination-modified on the surface of the metal particles using an atom or an atomic group of either or both of sulfur and oxygen as an anchor, wherein the protective agent has one, or two or more functional groups selected from the group consisting of alkoxysilyl group, silanol group and hydroxyalkyl group in a molecular structure.
    Type: Application
    Filed: June 22, 2005
    Publication date: November 13, 2008
    Inventors: Reiko Kiyoshima, Toshiharu Hayashi
  • Publication number: 20070134491
    Abstract: Each of the metal nano-particles present in a dispersion, which comprises at least one metal selected from the group consisting of precious metals and transition metals or an alloy of at least two metals selected from the foregoing metals, comprises a metal particle in which an organic metal compound of a fatty acid and/or an amine-metal complex is adhered to the periphery of the metal particle. This organic metal compound and the amine-metal complex are admixed together in a solvent and then the resulting mixture is subjected to a reducing treatment to thus form a dispersion containing metal nano-particles in a concentration of not less than 5% by mass and not more than 90% by mass. The resulting dispersion is applied onto the surface of a base material, followed by drying the applied layer of the dispersion and then firing the dried layer of the dispersion at a low temperature to thus form a thin metallic wire or a metal film having conductivity.
    Type: Application
    Filed: September 7, 2004
    Publication date: June 14, 2007
    Inventors: Tsutomu Atsuki, Masaaki Oda, Toshiharu Hayashi, Reiko Kiyoshima