Patents by Inventor Reiko Koshida

Reiko Koshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030068497
    Abstract: Thermoplastic resin compositions are described in which amine salts of anthraquinone dyes and monoazo complex dyes are added. These compositions show superior performance in laser welding applications.
    Type: Application
    Filed: November 13, 2001
    Publication date: April 10, 2003
    Inventors: Reiko Koshida, Yoshiteru Hatase, Ryuichi Hayashi
  • Publication number: 20030065074
    Abstract: Thermoplatic resin compositions suitable for laser welding are discribed in which black colorants are added. These colorants constitute amine salt of anthraquinone dyes. Additional dyes, coloring agents, and a variety of other materials may be added. These compositions demonstrate outstanding mechanical and chemical properties once laser-welded.
    Type: Application
    Filed: April 26, 2002
    Publication date: April 3, 2003
    Inventors: Reiko Koshida, Yoshiteru Hatase, Ryuichi Hayashi, Hiroyuki Sumi
  • Publication number: 20030045618
    Abstract: Thermoplastic resin compositions suitable for laser welding are disclosed, which include a mixture of neutral anthraquinone dyes and at least one other red dye to absorb and transmit select regions of visible light and to enhance weldability.
    Type: Application
    Filed: November 13, 2001
    Publication date: March 6, 2003
    Inventors: Reiko Koshida, Yoshiteru Hatase, Ryuichi Hayashi, Hiroyuki Sumi
  • Publication number: 20030039837
    Abstract: Novel fabricated resin products are described and having suitability for laser welding applications. These contain a resin part for transmitting black colorant and a resin part for absorbing black colorant.
    Type: Application
    Filed: November 13, 2001
    Publication date: February 27, 2003
    Inventors: Reiko Koshida, Yoshiteru Hatase, Ryuichi Hayashi
  • Publication number: 20030036625
    Abstract: The instant invention provides an aromatic polyamide composition for molding which is of superior rigidity, strength, toughness, dimensional stability, resistance to chemicals, external surface appearance and sliding characteristics in high-humidity, high-temperature environments, which has a low coefficient of linear expansion and which is of low warpage.
    Type: Application
    Filed: June 27, 2002
    Publication date: February 20, 2003
    Inventors: Masahiro Nozaki, Reiko Koshida, Takeo Tasaka, Tadao Ushida
  • Publication number: 20020156161
    Abstract: Thermoplastic resin compositions are disclosed that incorporate 1:2 metallic azo complex dyes and are particularly suitable for laser welding. These compositions include a variety of thermoplastic resins such as polyamides and copolymers and blends thereof. The compositions offer superior welding properties and provide for the welding of articles identically colored with these dyes.
    Type: Application
    Filed: February 9, 2001
    Publication date: October 24, 2002
    Inventors: Reiko Koshida, Yoshiteru Hatase
  • Publication number: 20020103281
    Abstract: This invention deals with the development of improved SMT performance flame retardant polyamide compositions. The compositions include replacing the poly bromostyrene or brominated polystyrene with a copolymer of a halostyrene and glycidyl (meth) acrylate. The resulting composition results in greatly improved blistering performance in Surface Mounting Technology Applications.
    Type: Application
    Filed: September 21, 2001
    Publication date: August 1, 2002
    Inventors: Marvin Michael Martens, Reiko Koshida, Jennifer L. Bohan, William Ray Fielding
  • Patent number: 6350802
    Abstract: Certain polyamide molding compositions are disclosed having improved flame resistance and heat stability. These compositions comprise in weight percent, 20-78% polyamide having a melting point of 280-340° C.; 10-60% inorganic filler; 10-35% flame retardant (brominated or chlorinated); 1-10% antimony compound; 1-10% of one or more oxides, hydroxides, or salts of weak mineral acids, and combinations thereof; and 0-2% heat stabilizer.
    Type: Grant
    Filed: March 17, 1999
    Date of Patent: February 26, 2002
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Marvin Michael Martens, Reiko Koshida, Wendy Tobin, Jocelyn M. Willis
  • Publication number: 20010056145
    Abstract: Certain polyamide molding compositions are disclosed having improved flame resistance and heat stability. These compositions comprise in weight percent, 20-78% polyamide having a melting point of 280-340° C.; 10-60% inorganic filler; 10-35% flame retardant (brominated or chlorinated); 1-10% antimony compound; 1-10% of one or more oxides, hydroxides, or salts of weak mineral acids, and combinations thereof; and 0-2% heat stabilizer.
    Type: Application
    Filed: March 17, 1999
    Publication date: December 27, 2001
    Inventors: MARVIN MICHAEL MARTENS, REIKO KOSHIDA, WENDY TOBIN
  • Patent number: 5856428
    Abstract: An aromatic polyamide resin composition composed of two types of aromatic polyamide (A) and (B), where (A) is an aromatic polyamide wherein the molar ratio of aromatic polyamide with respect to the monomer components that constitute the polyamide is 0.4 or greater, and (B) is an aromatic polyamide containing an aromatic monomer as the monomer component that constitutes the polyamide and has a recrystallization temperature that is lower than that of the aromatic polyamide (A), where said aromatic polyamide resin composition has a recrystallization temperature that is 10.degree. C. or more lower than the recrystallization temperature of the aromatic polyamide (A).Merit:The aromatic polyamide composition of the present invention has the high heat resistance characteristic of aromatic polyamides, superior dimensional stability with respect to water absorption, and maintenance of physical stability and chemical resistance, while providing improved molding characteristics.
    Type: Grant
    Filed: October 1, 1996
    Date of Patent: January 5, 1999
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Ryuichi Hayashi, Reiko Koshida
  • Patent number: 5770679
    Abstract: Polyamide resin compositions which are useful for molding parts with excellent malleability, thoughness, rigidity, and high heat deformation temperatures are prepared from 10 to 89% by weight of a polyamide resin, 1 to 30% by weight of at least one type of elastomer selected from among elastomers composed of ethylene/propylene/dienes, elastomers composed of ethylene/unsaturated carboxylic acid unsaturated carboxylic acid esters, and elastomers obtained by graft-modifying these elastomers, and from 10 to 60% by weight of a copolymer of ethylene and cyclic olefin that is noncrystalline and has a glass transition temperature of from 100.degree. to 190.degree. C.
    Type: Grant
    Filed: June 13, 1996
    Date of Patent: June 23, 1998
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Ryuichi Hayashi, Reiko Koshida