Patents by Inventor Reiko Mishima

Reiko Mishima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130269992
    Abstract: An insulating structure is formed that favorably maintains gap-fill capability of a narrow width pattern in a memory cell while also preventing the formation of cracks in an insulator in a peripheral circuit, and has the memory cell and peripheral circuit within the same layer. The present invention provides an insulating structure comprising a substrate and a circuit pattern formed on the substrate, wherein the circuit pattern has a narrow width region having a narrow width pattern of a width of 30 nm or less and a wide width region having a wide width pattern of a width of greater than 100 nm in the same layer, and the same insulating composition is formed within the narrow width pattern and within the wide width pattern.
    Type: Application
    Filed: December 22, 2011
    Publication date: October 17, 2013
    Applicant: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Ichiro Doi, Shozo Takada, Reiko Mishima, Hideo Saito