Patents by Inventor Reiko OKUNO

Reiko OKUNO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240060555
    Abstract: [Means for Solution] A gear member includes a tooth having a tooth flank whose profile is an involute curve, wherein in a cross-section of the tooth perpendicular to a face width direction, the tooth has a depression, near a top land, hollowed in the tooth flank relative to the involute curve.
    Type: Application
    Filed: September 25, 2020
    Publication date: February 22, 2024
    Inventors: Reiko OKUNO, Shinichi HIRONO, Toshiyuki KOSUGE, Heisuke KOBAYASHI, Shinya KURIHARA, Katsuhiko YAZAMA
  • Patent number: 11460061
    Abstract: A joined component includes a first member provided with a first joint surface having an arranging part where a brazing filler material is arranged, a second member joined to the first member by brazing, and provided with a second joint surface having an accommodating recess that opposes the arranging part, a guide groove formed in the first joint surface or the second joint surface, and extending from the arranging part or the accommodating recess toward a fringe of the first joint surface or the second joint surface, and a chamfer formed along the fringe of the first joint surface or the second joint surface, and the guide groove communicates to the chamfer.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: October 4, 2022
    Assignee: SUMITOMO ELECTRIC SINTERED ALLOY, LTD.
    Inventors: Reiko Okuno, Masaaki Eida
  • Publication number: 20210033124
    Abstract: A joined component includes a first member provided with a first joint surface having an arranging part where a brazing filler material is arranged, a second member joined to the first member by brazing, and provided with a second joint surface having an accommodating recess that opposes the arranging part, a guide groove formed in the first joint surface or the second joint surface, and extending from the arranging part or the accommodating recess toward a fringe of the first joint surface or the second joint surface, and a chamfer formed along the fringe of the first joint surface or the second joint surface, and the guide groove communicates to the chamfer.
    Type: Application
    Filed: July 23, 2018
    Publication date: February 4, 2021
    Inventors: Reiko OKUNO, Masaaki EIDA
  • Patent number: 10603732
    Abstract: It is an object of the present invention to effectively suppress the overflow of brazing material from each joint of a sinter-brazed component, such as a planetary carrier, obtained by brazing a plurality of members together. According to the present invention, there is provided a sinter-brazed component obtained by mating and joining a first member having a first bonding surface and a second member having a second bonding surface to each other. Brazing material is provided between the first bonding surface and the second bonding surface. The first bonding surface has a first recess, the first recess having an inner peripheral wall and a bottom surface. The inner peripheral wall extends along and on an inner side of a profile line of the first bonding surface.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: March 31, 2020
    Assignee: SUMITOMO ELECTRIC SINTERED ALLOY, LTD.
    Inventors: Shinichi Hirono, Reiko Okuno
  • Publication number: 20170252844
    Abstract: It is an object of the present invention to effectively suppress the overflow of brazing material from each joint of a sinter-brazed component, such as a planetary carrier, obtained by brazing a plurality of members together. According to the present invention, there is provided a sinter-brazed component obtained by mating and joining a first member having a first bonding surface and a second member having a second bonding surface to each other. Brazing material is provided between the first bonding surface and the second bonding surface. The first bonding surface has a first recess, the first recess having an inner peripheral wall and a bottom surface. The inner peripheral wall extends along and on an inner side of a profile line of the first bonding surface.
    Type: Application
    Filed: August 4, 2015
    Publication date: September 7, 2017
    Inventors: Shinichi HIRONO, Reiko OKUNO