Patents by Inventor Reiko Shimoda

Reiko Shimoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component, method of producing the same, and circuit substrate
    Patent number: 9818543
    Abstract: An electronic component includes: a chip having first and second end surfaces oriented in a direction of a first axis, first and second main surfaces oriented in a direction of a second axis orthogonal to the first axis, first and second side surfaces oriented in a direction of a third axis orthogonal to the first and second axes, and first and second external electrodes respectively covering the first and second end surfaces and each extending to the first and second main surfaces and side surfaces; a covering portion covering the chip from the first main surface toward the second main surface; and exposed portions provided to the second main surface, including regions where the first and second external electrodes are exposed without being covered with the covering portion, and being pushed out toward the first main surface along ridges connecting the first and second end surfaces and side surfaces.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: November 14, 2017
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Mikio Tahara, Tomoaki Nakamura, Kayoko Hirayama, Reiko Shimoda
  • Electronic Component, Method of Producing the Same, and Circuit Substrate
    Publication number: 20170154731
    Abstract: An electronic component includes: a chip having first and second end surfaces oriented in a direction of a first axis, first and second main surfaces oriented in a direction of a second axis orthogonal to the first axis, first and second side surfaces oriented in a direction of a third axis orthogonal to the first and second axes, and first and second external electrodes respectively covering the first and second end surfaces and each extending to the first and second main surfaces and side surfaces; a covering portion covering the chip from the first main surface toward the second main surface; and exposed portions provided to the second main surface, including regions where the first and second external electrodes are exposed without being covered with the covering portion, and being pushed out toward the first main surface along ridges connecting the first and second end surfaces and side surfaces.
    Type: Application
    Filed: August 31, 2016
    Publication date: June 1, 2017
    Inventors: Mikio Tahara, Tomoaki Nakamura, Kayoko Hirayama, Reiko Shimoda