Patents by Inventor Reinald John Salazar ROSCAIN

Reinald John Salazar ROSCAIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10714413
    Abstract: The present disclosure relates to a lead frame assembly for a semiconductor device. The leadframe assembly includes a clip frame structure with a die connection portion configured and arranged for contacting to one or more contact terminals on a top side of a semiconductor die; and one or more electrical leads extending from the die connection portion at a first end. The die connection portion includes a hooking tab extending therefrom configured and arranged to engage with a wire loop of a wire pull test equipment. The disclosure also relates to an interconnected matrix of such leadframe.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: July 14, 2020
    Assignee: Nexperia B.V.
    Inventors: Ricardo Lagmay Yandoc, Adam Richard Brown, Reinald John Salazar Roscain
  • Publication number: 20200194354
    Abstract: The present disclosure relates to a lead frame assembly for a semiconductor device. The leadframe assembly includes a clip frame structure with a die connection portion configured and arranged for contacting to one or more contact terminals on a top side of a semiconductor die; and one or more electrical leads extending from the die connection portion at a first end. The die connection portion includes a hooking tab extending therefrom configured and arranged to engage with a wire loop of a wire pull test equipment. The disclosure also relates to an interconnected matrix of such leadframe.
    Type: Application
    Filed: December 16, 2019
    Publication date: June 18, 2020
    Applicant: NEXPERIA B.V.
    Inventors: Ricardo Lagmay YANDOC, Adam Richard BROWN, Reinald John Salazar ROSCAIN