Abstract: A method for inspection of a patterning device. The method includes obtaining (i) patterning device apparatus data of a patterning device making process, (ii) a patterning device substrate map based on the patterning device apparatus data, and (iii) predicted process window limiting pattern locations corresponding to the patterning device based on the patterning device substrate map, and based on the process window limiting pattern locations, guiding a patterning device inspection apparatus to the process window limiting pattern locations for defect inspection.

Abstract: Methods and apparatuses for estimating at least part of a shape of a surface of a substrate usable in fabrication of semiconductor devices. Such a method includes: obtaining at least one focal position of the surface of the substrate measured by an inspection apparatus, the at least one focal position for bringing targets on or in the substrate within a focal range of optics of the inspection apparatus; and determining the at least part of the shape of the surface of the substrate based on the at least one focal position.

Abstract: A method for inspection of a patterning device. The method includes obtaining (i) patterning device apparatus data of a patterning device making process, (ii) a patterning device substrate map based on the patterning device apparatus data, and (iii) predicted process window limiting pattern locations corresponding to the patterning device based on the patterning device substrate map, and based on the process window limiting pattern locations, guiding a patterning device inspection apparatus to the process window limiting pattern locations for defect inspection.

Abstract: A metrology system can be integrated within a lithographic apparatus to provide integrated metrology within the lithographic process. However, this integration can result in a throughput or productivity impact of the whole lithographic apparatus which can be difficult to predict. It is therefore proposed to acquire throughput information associated with a throughput of a plurality of substrates within a lithographic apparatus, the throughput information including a throughput parameter, and predict, using a throughput simulator, a throughput using the throughput parameter as an input parameter. The throughput simulator may be calibrated using the acquired throughput information. The impact of at least one change of a throughput parameter on the throughput of the lithographic apparatus may be predicted using the throughput simulator.

Abstract: A method of patterning of at least a layer in a semiconductor device, the method including a patterning step by a patterning means, wherein the patterned layer comprises sensing radiation transmissive portions and sensing radiation blocking portions.

Abstract: Increasingly, metrology systems are integrated within the lithographic apparatuses, to provide integrated metrology within the lithographic process. However, this integration can result in a throughput or productivity impact of the whole lithographic apparatus which can be difficult to predict. It is therefore proposed to provide a simulation model which is operable to acquire throughput information associated with a throughput of a plurality of substrates within a lithographic apparatus, said throughput information comprising a throughput parameter, predict, using a throughput simulator the throughput using the throughput parameter as an input parameter. The throughput simulator may be calibrated using the acquired throughput information. The impact of at least one change of a throughput parameter on the throughput of the lithographic apparatus may be predicted using the throughput simulator.

Abstract: A metrology apparatus is arranged to illuminate a plurality of targets with an off-axis illumination mode. Images of the targets are obtained using only one first order diffracted beam. Where the target is a composite grating, overlay measurements can be obtained from the intensities of the images of the different gratings. Overlay measurements can be corrected for errors caused by variations in the position of the gratings in an image field.

Abstract: A metrology tool is arranged to measure a parameter of a substrate that has been provided with a pattern in a lithographic apparatus. The metrology tool includes a base frame, a substrate table, a sensor, a displacement system, a balance mass, and a bearing. The substrate table is constructed and arranged to hold the substrate. The sensor is constructed and arranged to measure a parameter of the substrate. The displacement system is configured to displace the substrate table or the sensor with respect to the other in a first direction. The bearing is configured to movably support the first balance mass so as to be substantially free to translate in a direction opposite of the first direction in order to counteract a displacement of the substrate table or sensor in the first direction.

Abstract: A metrology apparatus is arranged to illuminate a plurality of targets with an off-axis illumination mode. Images of the targets are obtained using only one first order diffracted beam. Where the target is a composite grating, overlay measurements can be obtained from the intensities of the images of the different gratings. Overlay measurements can be corrected for errors caused by variations in the position of the gratings in an image field.

Abstract: A lithographic apparatus configured to transfer a pattern from a patterning device onto a substrate includes an integrated post-exposure bake device, the post-exposure bake device configured to subject the substrate to a predefined temperature cycle. A post-exposure bake step of the substrate (a temperature cycle) is executed within a predetermined time period after the transfer of the pattern. The lithographic apparatus may be combined with a processing system having one or more processing modules. More efficient use may be made of the combination, allowing flexibility for a device manufacturing method.

Abstract: To inspect all portions of the substrate the substrate table can be moved rotationally and linearly. Furthermore the detector can be moved rotationally. This enables all portions of a surface of the substrate to be inspected from all angles in a plane parallel to the substrate. Less linear motion is needed, so the apparatus occupies a smaller volume and generates smaller vibrations.

Abstract: A metrology tool is arranged to measure a parameter of a substrate that has been provided with a pattern in a lithographic apparatus. The metrology tool includes a base frame, a substrate table, a sensor, a displacement system, a balance mass, and a bearing. The substrate table is constructed and arranged to hold the substrate. The sensor is constructed and arranged to measure a parameter of the substrate. The displacement system is configured to displace the substrate table or the sensor with respect to the other in a first direction. The bearing is configured to movably support the first balance mass so as to be substantially free to translate in a direction opposite of the first direction in order to counteract a displacement of the substrate table or sensor in the first direction.

Abstract: A metrology tool is arranged to measure a parameter of a substrate that has been provided with a pattern in a lithographic apparatus. The metrology tool includes a base frame, a substrate table constructed and arranged to hold the substrate, a sensor constructed and arranged to measure a parameter of the substrate, a displacement system configured to displace the substrate table or the sensor with respect to the other in a first direction, a balance mass, and a bearing configured to movably support the first balance mass so as to be substantially free to translate in a direction opposite of the first direction in order to counteract a displacement of the substrate table or sensor in the first direction.

Abstract: A lithography system in which a performance criterion of the lithography system is predicted, based on one or more operating conditions of the lithography system, and compared to measurements of that performance criterion. The lithography system may determine from a difference between the measured and predicted performance criterion which, if any, sub-system of the lithography system is not performing as expected.

Abstract: A metrology tool is arranged to measure a parameter of a substrate that has been provided with a pattern in a lithographic apparatus. The metrology tool includes a base frame, a substrate table constructed and arranged to hold the substrate, at least one sensor constructed and arranged to measure a parameter of the substrate, a displacement system to displace one of the substrate table and sensor with respect to the other one of the substrate table and sensor in at least a first direction, a first balance mass, and a first bearing which movably supports the first balance mass so as to be substantially free to translate in the opposite direction of the first direction in order to counteract a displacement of the one of the substrate table and sensor in the first direction.

Abstract: A sensor measuring properties of a substrate in which radiation is projected onto the substrate by a radiation projector that has a first part configured such that the radiation projection can project onto the substrate linearly polarized radiation oriented in a first direction and a second part configured such that the radiation projector can project onto the substrate linearly polarized radiation oriented in a second direction orthogonal to the first direction.

Abstract: Two drive systems are responsible for moving a substrate beneath, for example, an illumination system or a measurement radiation beam. A first drive system drives a substrate in a X direction and a second drive system drives the substrate in a Y direction. In order to make a measurement of a feature of the substrate surface, targets are arranged in a lattice. Rather than having the lattice aligned with the X and Y directions such that only one drive system operates at a time to step between the targets, the lattice of targets is arranged at an angle with respect to the X and Y axes such that both drive systems operate simultaneously in order to move between the targets. The targets (or sub-targets within the targets) may also be arranged with respect to each other so as to save scribelane space and to create a most economical path between them.

Abstract: A lithography system in which a performance criterion of the lithography system is predicted, based on one or more operating conditions of the lithography system, and compared to measurements of that performance criterion. The lithography system may determine from a difference between the measured and predicted performance criterion which, if any, sub-system of the lithography system is not performing as expected.

Abstract: A lithographic apparatus configured to transfer a pattern from a patterning device onto a substrate includes an integrated post-exposure bake device, the post-exposure bake device configured to subject the substrate to a predefined temperature cycle. A post-exposure bake step of the substrate (a temperature cycle) is executed within a predetermined time period after the transfer of the pattern. The lithographic apparatus may be combined with a processing system having one or more processing modules. More efficient use may be made of the combination, allowing flexibility for a device manufacturing method.

Abstract: A lithography system in which a performance criterion of the lithography system is predicted, based on one or more operating conditions of the lithography system, and compared to measurements of that performance criterion. The lithography system may determine from a difference between the measured and predicted performance criterion which, if any, sub-system of the lithography system is not performing as expected.