Patents by Inventor Reiner Götzen

Reiner Götzen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8042267
    Abstract: The invention relates to a method for producing microsystems comprising microelectronic components that are inserted into cavities created during the layered construction of a base body consisting of a photocurable material, said components being situated adjacent to and/or above one another on several planes and being interconnected either electrically or thermally.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: October 25, 2011
    Assignee: microTec Gesellschaft für Mikrotechnologie mbH
    Inventor: Reiner Götzen
  • Patent number: 7718127
    Abstract: The invention relates to a microfluidic chip for biological, chemical and medical analysis. Cavities and channels, which connect these cavities to one another and which transport, based on the capillary effect, liquids required for carrying out analysis and synthesis, are arranged inside the microfluidic chip. At least one of the cavities is a reaction chamber. The microfluidic chip is characterized by having a layered construction made of light-curing hydrophilic plastic material based on a 3-D layer model and by having a covering layer made of a hydrophobic material. In the layered body made of hydrophilic material, channels that come from different cavities and do not intersect lead to the at least one reaction chamber.
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: May 18, 2010
    Assignee: microTec Gesellschaft für Mikrotechnologie mbH
    Inventor: Reiner Götzen
  • Patent number: 6805829
    Abstract: The invention relates to a method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows. Various light-setting materials are used for the production of the layers. Upon exchanging the materials, those layer regions in which no setting occurred during the preceding setting process, are also filled with new material, such that, in the subsequent setting process, not only is the upper layer linked to the one lying directly beneath it, but also material of the upper layer is connected to the material of a layer lying below the penultimate layer. It is thus possible, within the layer sequence, to connect a structure with varying properties from layer to layer.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: October 19, 2004
    Inventor: Reiner Götzen