Abstract: A carrier for holding a substrate is described. The carrier includes a carrier body having a first surface, and an adhesive arrangement provided on the first surface. The carrier body includes one or more conduits configured for providing a gas into the adhesive arrangement. Further, a method for controlling a temperature of a substrate is described. The method includes providing a carrier as described herein; supplying a gas through the one or more conduits into the adhesive arrangement; and providing the gas to a backside of the substrate attached to the adhesive arrangement.

Abstract: A carrier for carrying a substrate in a deposition chamber is described. The carrier includes a frame for vertically holding the substrate, wherein the frame has a substantially rectangular shape with a bottom frame part; a fixing means for firmly fixing the substrate to the carrier, wherein the fixing means is located in a center region of the bottom frame part; and one or more support members for supporting but not firmly fixing the substrate. Further, a method for carrying a substrate during deposition is described.

Abstract: A chamber for physical vapor deposition is provided. The chamber includes a housing, a door for opening and closing the housing, and a bearing for receiving a target, wherein the bearing is oriented in a first direction. Further, the chamber is adapted so that the target is at least partially removable from the chamber in the first direction. According to an embodiment, a chamber for physical vapor deposition is provided. The chamber is adapted for receiving at least one target and a substrate. The chamber includes a housing, a door, and at least one bearing for mounting the target, wherein the bearing is attached to the door.

Abstract: Carriers for substrates and to methods for assembling the same in the field of vacuum deposition of thin films. In particular, a carrier for a substrate to be coated in a vacuum chamber includes a first frame comprising two vertical sections and two horizontal sections being dimensioned to surround the substrate; a second dimensioned to define an area of the substrate to be coated, and to cover at least a first part of the first frame to prevent the first part of the first frame from being coated when the second frame is mounted to the first frame. The second frame is detachably mounted to the first frame.

Abstract: A chamber for physical vapour deposition is provided. The chamber includes a housing, a door for opening and closing the housing, and a bearing for receiving a target, wherein the bearing is oriented in a first direction. Further, the chamber is adapted so that the target is at least partially removable from the chamber in the first direction. According to an embodiment, a chamber for physical vapour deposition is provided. The chamber is adapted for receiving at least one target and a substrate. The chamber includes a housing, a door, and at least one bearing for mounting the target, wherein the bearing is attached to the door.

Abstract: A device for transporting substrates through a vacuum system has a flat, parallel piped, plate-shaped substrate holder with upper and lower holder areas that are moveable in a vertical position along a transport path through the system. The upper part of the substrate holder is supported without contact and is movably guided by a magnetic arrangement.

Abstract: An evacuable chamber serving as a cathode contains a rotatable magnet system and is connected to a high frequency power supply for sputtering a target. The chamber is electrically isolated from an evacuable housing containing the substrate to be coated, the chamber being covered by a cup-like shield fixed to the housing to define an interior space. A pipe for evacuating the chamber includes first and second sections separated by a gap and connected by an electrically insulating collar in which parallel metal grids are installed in the gap and respectively connected to the power source and to ground in order to prevent the formation of secondary plasma.

Abstract: Individual target segments (A-F), are mounted on a mounting plate by means of locating studs inserted into mounting holes of elongate or circular cross sections in correspondence with the change in length caused by the thermal expansion of the target segments. The segments are retained by screws received in tapped bones in the studs, which are welded to the target backplates. The individual segments (A-F) each consist of a target backplate and a target bonded to the backplate. The perimeter of each backplate over laps the perimeter of each target segment, this overlap amounting to 0.05-0.2 mm when molybdenum or titanium is used for the target backplate and an indium-tin alloy is used for the sputter target.