Abstract: For an electronic circuit module (1), more particularly a circuit module that is used as an inverter for an electrical machine or as a converter, comprising at least one electronics unit (4), more particularly a power electronics unit, wherein the electronics unit (4) comprises at least one carrier substrate (5) and at least one electrical and/or electronic component (32) provided on the carrier substrate (5), at least one first connection point (10) and at least two second connection points (20) are formed on the carrier substrate (5) on a substrate top side (7) of the carrier substrate (5), the first connection point (10) is provided between the two second connection points (20), and wherein the electronic circuit module (1) further comprises at least one electrical or electronic part (8) having at least one first bus bar (12) for electrically contacting the electronic part (8) and at least one second bus bar (22) for electrically contacting the electronic part (8), the invention proposes that an electrical

Abstract: For an electronic circuit module (1), more particularly a circuit module that is used as an inverter for an electrical machine or as a converter, comprising at least one electronics unit (4), more particularly a power electronics unit, wherein the electronics unit (4) comprises at least one carrier substrate (5) and at least one electrical and/or electronic component (32) provided on the carrier substrate (5), at least one first connection point (10) and at least two second connection points (20) are formed on the carrier substrate (5) on a substrate top side (7) of the carrier substrate (5), the first connection point (10) is provided between the two second connection points (20), and wherein the electronic circuit module (1) further comprises at least one electrical or electronic part (8) having at least one first bus bar (12) for electrically contacting the electronic part (8) and at least one second bus bar (22) for electrically contacting the electronic part (8), the invention proposes that an electrical

Abstract: Low-inductance connecting device (10) for connecting a semiconductor module (20) to an intermediate circuit capacitor (30), comprising at least one first contact region (11a) and one second contact region (12) which has opposite polarity to the first contact region (11a), which first and second contact region are designed to make contact with the semiconductor module (20), at least one third contact region (13a) which has the same polarity as the first contact region (11a) and one fourth contact region (14) which has opposite polarity to the third contact region (13a), which third and fourth contact regions are designed to make contact with the intermediate circuit capacitor (30), at least one first connecting region (15a) which is designed to connect the first contact region (11a) and the third contact region (13a) to one another, and at least one second connecting region (16a) which is designed to connect the second contact region (12) and the fourth contact region (14) to one another, wherein the first con

Abstract: An electronic circuit unit (1) comprising at least one electrical or electronic device (8) with at least one terminal contact (101), the at least one terminal contact (101) being connected in an electrically conducting manner to at least one terminal pad (100), at least one terminal contact (101) and at least one terminal pad (100) are surrounded in the region of the electrical point of contact by an electrically insulating compound (9), the electrical or electronic device (8) being arranged outside the electrically insulating compound (9).

Abstract: An electronic circuit unit (1) comprising at least one electrical or electronic device (8) with at least one terminal contact (101), the at least one terminal contact (101) being connected in an electrically conducting manner to at least one terminal pad (100), at least one terminal contact (101) and at least one terminal pad (100) are surrounded in the region of the electrical point of contact by an electrically insulating compound (9), the electrical or electronic device (8) being arranged outside the electrically insulating compound (9).

Abstract: A method for connecting an electronic components to a carrier substrate is described. At least one pad of the component is connected electrically conductively to at least one pad on an upper surface of the carrier substrate. A solder bump is deposited on at least one of the pads to be connected, the component is alignedly mated with the carrier substrate, and the at least one solder bump is soldered in order to wet the contact surfaces. It is provided that during the soldering, the at least one solder bump is deformed within the contacting plane in such a way as to achieve a degree of deformation that permits the two-dimensional analysis of said degree of deformation by a radiograph of the interconnection site.

Abstract: The firing apparatus for a gas generator of a restraint device in a vehicle has a firing chamber filled with a pyrotechnic material. A semiconductor chip, in which in addition to a firing resistor at least one circuit activating the latter is integrated, is arranged outside the firing chamber in such a way that the thermal energy generated by the firing resistor during a firing operation is transferred to the pyrotechnic material in the firing chamber. To ensure that upon firing, the circuit elements in the firing apparatus remain undestroyed to the greatest possible extent, the semiconductor chip is retained on a circuit board; the circuit board is retained, with the side opposite the semiconductor chip, on a wall of the firing chamber; and an opening is present in the wall of the firing chamber and in the circuit board, so that a passage exists between the firing resistor mounted on the semiconductor chip and the pyrotechnic material in the firing chamber.

Abstract: The firing apparatus for a gas generator of a restraint device in a vehicle has a firing chamber (1) filled with a pyrotechnic material (2). A semiconductor chip (6), in which in addition to a firing resistor (9) at least one circuit activating the latter is integrated, is arranged outside the firing chamber (1) in such a way that the thermal energy generated by the firing resistor (9) during a firing operation is transferred to the pyrotechnic material (2) in the firing chamber (1).

Abstract: A structural arrangement for NOx sensors including a first selectively oxygen ion-conductive layer and a second gas-permeable, nonconductive layer, the latter having a porous spinel structure or porous platinum. The oxygen ion-conductive layer made from a mixed-conductive ceramic can have an additional layer of a material which is catalytically inactive to NOx.

Abstract: A force sensor has a measuring diaphragm adapted to undergo a deflection in response to a force being applied thereto. The force sensor further has a test deflection device operatively coupled to the measuring diaphragm for effecting a test deflection thereof independently of any force external to the force sensor being applied to the measuring diaphragm.

Abstract: An electrochemical measuring sensor having a solid electrolyte, a first electrode exposed to a gas to be measured and a second electrode exposed to a reference gas, with the electrodes preferably being arranged on opposite sides of the solid electrolyte. At least one of the electrodes (16, 20) is provided with a contouring (24) on its side (22) that is exposed to the gas to be measured or to the reference gas, with the contouring being a trench-shaped groove (26) embossed into the surface of the electrode such that the electrode is pressed into the adjacent solid electrolyte in the region of the groove. According to the method, the embossing is done while the electrode and the solid electrolyte are in the non-sintered state, and the sensor is subsequently sintered.

Abstract: A fuel injection valve for internal combustion engines with a valve member which is displaced in a bore in a valve body by the fuel pressure, counter to the action of a closing spring. The valve body has at a combustion-space end, a valve head which on a side which faces the valve body is arranged a sealing surface which interacts with a valve seat provided on the combustion-space end of the valve body, forming a sealing cross section, and including injection apertures which permit a flow of fuel from a pressure space in the valve body to the combustion space of the internal combustion engines and has an aperture cross section which can be varied as a function of the stroke of the valve member.