Abstract: In an apparatus for the automatic casting, coating, varnishing, inspecting and sorting of workpieces--especially of optical or magneto-optical data storages--with at least one transport apparatus advancing the substrates from a production station to the processing stations, and with a stacking station for the separate stacking of workpieces that are finished and have been found perfect and workpieces containing defects, a substrate transporting apparatus is provided which has a transport carriage (3) which can be moved back and forth along a straight line and has three transport arms (4,4',4'';5,5',5'') bearing substrate holders (6, 6',6'';7,7',7'') on each side of the carriage.

Abstract: Target for reactive sputtering in a vacuum coating apparatus consists of at least one of tin and lead doped with 20 to 200 ppm gallium and 2 to 20 ppm phosphorus.

Abstract: In a high-rate sputtering apparatus including an anode and a cathode, the cathode having an upper sputtering surface upon which is a material to be sputtered onto a substrate, an improved cooling system. The cooling system includes a carrier plate in supporting contact with the cathode and having a lateral surface in which is formed a channel groove. Coolant tubes having outside walls in selective contact with the inside walls of the channel groove and with the lower, contact surface of the cathode are provided, with the coolant tubes further having cross-sectional profiles corresponding to those of the channel grooves. The coolant tubes may also include a plurality of longitudinally extending beads formed in the outside walls to facilitate expansion.

Abstract: In an apparatus for applying materials to a substrate (15) disposed in a vacuum chamber (17), having an electron emitter (9) and having magnet coils (30, 39) disposed outside of the vacuum chamber (16, 17), the electron emitter (9) is disposed in a separate generator chamber (37) communicating with the vacuum chamber (17) and forming the anode (11) and, after the introduction of the process gas into the generator chamber (37), produces a large-area plasma jet (S) which, under the action of magnets (12, 21), passes through an opening (25) in the wall (28) of the vacuum tank (1) forming the vacuum chamber (16, 17). The positive ions are accelerated, by application of a variable negative voltage, from the plasma jet (S) onto the target (7) of drum-shaped configuration mounted in the vacuum chamber (17) for rotation on a pedestal (24), from which target the sputtered metal atoms are deflected onto the substrate (15).