Patents by Inventor Reiner Welzer

Reiner Welzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Filter assembly comprising two bulk wave resonators
    Patent number: 7821357
    Abstract: An arrangement includes a substrate, a filter, a first bulk acoustic wave resonator, a second bulk acoustic wave resonator, and a large surface covering. The first bulk acoustic wave resonator includes a first electrode and a second electrode and is arranged flatly on the substrate. The second bulk acoustic wave resonator includes a first electrode and a second electrode and is arranged flatly on the substrate. The large-surface covering includes a metal layer over the substrate. The metal layer is connected to a ground terminal.
    Type: Grant
    Filed: June 8, 2005
    Date of Patent: October 26, 2010
    Assignee: Epcos AG
    Inventors: Habbo Heinze, Jürgen Kiwitt, Edgar Schmidhammer, Pasi Tikka, Reiner Welzer
  • Filter Assembly Comprising Two Bulk Wave Resonators
    Publication number: 20080246556
    Abstract: An arrangement includes a substrate, a filter, a first bulk acoustic wave resonator, a second bulk acoustic wave resonator, and a large surface covering. The first bulk acoustic wave resonator includes a first electrode and a second electrode and is arranged flatly on the substrate. The second bulk acoustic wave resonator includes a first electrode and a second electrode and is arranged flatly on the substrate. The large-surface covering includes a metal layer over the substrate. The metal layer is connected to a ground terminal.
    Type: Application
    Filed: June 8, 2005
    Publication date: October 9, 2008
    Inventors: Habbo Heinze, Jurgen Kiwitt, Edgar Schmidhammer, Pasi Tikka, Reiner Welzer
  • Encapsulated electronics device with improved heat dissipation
    Patent number: 6992400
    Abstract: A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: January 31, 2006
    Assignees: Nokia Corporation, Epcos AG
    Inventors: Pasi Tikka, Edgar Schmidhammer, Habbo Heinze, Reiner Welzer, Herbert Zidek, Ansgar Schäufele, Juha Ellä
  • Method for improving heat dissipation in encapsulated electronic components
    Publication number: 20050167854
    Abstract: A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.
    Type: Application
    Filed: January 30, 2004
    Publication date: August 4, 2005
    Inventors: Pasi Tikka, Edgar Schmidhammer, Habbo Heinze, Reiner Welzer, Herbert Zidek, Ansgar Schaufele, Juha Ella