Abstract: Generally, the subject matter disclosed herein relates to methods for forming modern sophisticated semiconductor devices, and more specifically, methods wherein substantially lead-free solder bumps may be formed above a contact layer of a semiconductor chip. One illustrative method disclosed herein includes forming a solder bump above a metallization layer of a semiconductor device, removing an oxide film from a surface of the solder bump, and, after removing the oxide film, performing a solder bump reflow process in a reducing ambient to reflow the solder bump.

Abstract: The invention relates to a device for strip guidance in a hot medium, comprising a deflection roller (3, 38) which has two roller pins (23, 39) and is mounted to supporting arms (1, 2, 34, 37, 54, 57) by means of ceramic journal bearings (20, 31), wherein the journal bearings (20, 31) are in each case arranged in a bearing receptacle (45, 55) of the associated supporting arm (1, 2, 34, 37, 54, 57). The invention is characterized in that at least one of the journal bearings (20, 31) in its associated supporting arm (1, 2, 34, 37, 54, 57) is fixed in the bearing receptacle (45, 55) by means of a force-fit that engages on the outer edge of the journal bearing (20, 31) and balances the different heat expansion coefficients of the journal bearings (20, 31) and the bearing receptacle (45, 55).

Abstract: The invention relates to a device for strip guidance in a hot medium, comprising a deflection roller (3, 38) mounted on supporting arms (1, 2, 34, 37, 54, 57) and a carrier device holding the supporting arms (1, 2, 34, 37, 54, 57). The device is characterized in that one of the supporting arms (1, 2, 34, 37, 54, 57) is mounted on the carrier device by means of a floating bearing (5), wherein the floating bearing (5) allows the mounted supporting arm on the carrier device to move parallel to the longitudinal direction of the deflection roller (3, 38), and in that an elastic counter element (12), which acts parallel to the longitudinal direction of the deflection roller (3, 38) upon the supporting arm (1, 2, 34, 37, 54, 57) mounted on the floating bearing (5), is present and counteracts an increasing distance between the supporting arms (1, 2, 34, 37, 54, 57).

Abstract: Methods for wet etching a UBM layer and the resulting devices are disclosed. Embodiments may include patterning metal bumps on a wafer that has at least two metal layers thereon; exposing the wafer to a first acid solution to remove a portion of a first of the two metal layers exposed by the patterning of the metal bumps; and exposing the wafer to a second acid solution to remove a portion a second of the two metal layers exposed by the patterning of the metal bumps and the exposure of the wafer to the first acid solution, wherein an undercut below the metal bumps, formed by removal of the portions of the first and second metal layers, is less than 1.5 microns.

Abstract: Methods for wet etching a UBM layer and the resulting devices are disclosed. Embodiments may include patterning metal bumps on a wafer that has at least two metal layers thereon; exposing the wafer to a first acid solution to remove a portion of a first of the two metal layers exposed by the patterning of the metal bumps; and exposing the wafer to a second acid solution to remove a portion a second of the two metal layers exposed by the patterning of the metal bumps and the exposure of the wafer to the first acid solution, wherein an undercut below the metal bumps, formed by removal of the portions of the first and second metal layers, is less than 1.5 microns.

Abstract: Methods for etching copper in the fabrication of integrated circuits are disclosed. In one exemplary embodiment, a method for fabricating an integrated circuit includes providing an integrated circuit structure including a copper bump structure and a copper seed layer underlying and adjacent to the copper bump structure and etching the seed layer selective to the copper bump structure using a wet etching chemistry consisting of H3PO4 in a volume percentage of about 0.07 to about 0.36, H2O2 in a volume percentage of about 0.1 to about 0.7, and a remainder of H2O, and optionally NH4OH.

Abstract: Methods for etching copper in the fabrication of integrated circuits are disclosed. In one exemplary embodiment, a method for fabricating an integrated circuit includes providing an integrated circuit structure including a copper bump structure and a copper seed layer underlying and adjacent to the copper bump structure and etching the seed layer selective to the copper bump structure using a wet etching chemistry consisting of H3PO4 in a volume percentage of about 0.07 to about 0.36, H2O2 in a volume percentage of about 0.1 to about 0.7, and a remainder of H2O, and optionally NH4OH.

Abstract: Methods for wet etching a UBM layer and the resulting devices are disclosed. Embodiments may include patterning metal bumps on a wafer that has at least two metal layers thereon; exposing the wafer to a first acid solution to remove a portion of a first of the two metal layers exposed by the patterning of the metal bumps; and exposing the wafer to a second acid solution to remove a portion a second of the two metal layers exposed by the patterning of the metal bumps and the exposure of the wafer to the first acid solution, wherein an undercut below the metal bumps, formed by removal of the portions of the first and second metal layers, is less than 1.5 microns.

Abstract: The invention relates to a device for strip guidance in a hot medium, comprising a deflection roller (3, 38) mounted on supporting arms (1, 2, 34, 37, 54, 57) and a carrier device holding the supporting arms (1, 2, 34, 37, 54, 57). The device is characterized in that one of the supporting arms (1, 2, 34, 37, 54, 57) is mounted on the carrier device by means of a floating bearing (5), wherein the floating bearing (5) allows the mounted supporting arm on the carrier device to move parallel to the longitudinal direction of the deflection roller (3, 38), and in that an elastic counter element (12), which acts parallel to the longitudinal direction of the deflection roller (3, 38) upon the supporting arm (1, 2, 34, 37, 54, 57) mounted on the floating bearing (5), is present and counteracts an increasing distance between the supporting arms (1, 2, 34, 37, 54, 57).

Abstract: The invention relates to a device for strip guidance in a hot medium, comprising a deflection roller (3, 38) which has two roller pins (23, 39) and is mounted to supporting arms (1, 2, 34, 37, 54, 57) by means of ceramic journal bearings (20, 31), wherein the journal bearings (20, 31) are in each case arranged in a bearing receptacle (45, 55) of the associated supporting arm (1, 2, 34, 37, 54, 57). The invention is characterized in that at least one of the journal bearings (20, 31) in its associated supporting arm (1, 2, 34, 37, 54, 57) is fixed in the bearing receptacle (45, 55) by means of a force-fit that engages on the outer edge of the journal bearing (20, 31) and balances the different heat expansion coefficients of the journal bearings (20, 31) and the bearing receptacle (45, 55).

Abstract: Generally, the subject matter disclosed herein relates to methods for forming modern sophisticated semiconductor devices, and more specifically, methods wherein substantially lead-free solder bumps may be formed above a contact layer of a semiconductor chip. One illustrative method disclosed herein includes forming a solder bump above a metallization layer of a semiconductor device, removing an oxide film from a surface of the solder bump, and, after removing the oxide film, performing a solder bump reflow process in a reducing ambient to reflow the solder bump.