Abstract: Disclosed is a test method for testing a data store having an integrated test data compression circuit where the data store has a memory cell array with a multiplicity of addressable memory cells, read/write amplifiers for reading and writing data to the memory cell via an internal data bus in the data store and a test data compression circuit which compresses test data sequences, which are each read serially from the memory cell array, with stored reference test data sequences in order to produce a respective indicator data item which indicates whether at least one data error has occurred in the test data sequence which has been read.

Abstract: A memory system for network broadcasting applications, such as video/audio applications, has at least one memory which is divided into a plurality of addressable memory units, which have a respective dedicated output for interchanging data. The inputs of a matrix switch are connected to a respective output of a different memory unit. The matrix switch is operated such that a plurality of the memory units are connected to its output in a sequential order. A first sequence of memory units and a second sequence of memory units are connected to its output independently. This results in a memory system, which can handle a number of requests to the same memory at staggered times. The interaction of the individual memory units with the matrix switch allows a high data throughput and a short access time.

Abstract: A memory system for network broadcasting applications, such as video/audio applications, has at least one memory which is divided into a plurality of addressable memory units, which have a respective dedicated output for interchanging data. The inputs of a matrix switch are connected to a respective output of a different memory unit. The matrix switch is operated such that a plurality of the memory units are connected to its output in a sequential order. A first sequence of memory units and a second sequence of memory units are connected to its output independently. This results in a memory system, which can handle a number of requests to the same memory at staggered times. The interaction of the individual memory units with the matrix switch allows a high data throughput and a short access time.

Abstract: A test configuration that includes a device and a method for testing the device in which test results determined during the testing of the device are stored in a memory in the device. In this way, the test results are connected with the device and available at any time for later evaluations.

Abstract: To be able to test a plurality of identical semiconductor circuit devices in a particularly rapid yet reliable manner, a test method includes carrying out the tests in parallel and substantially simultaneously on the plurality of semiconductor circuit devices and driver lines—used in the process—of a test device to the semiconductor circuit devices simultaneously and jointly for all the semiconductor circuit devices. In such a case, test results are read from a plurality of input/output channels in compressed form. Furthermore, as an alternative or in addition thereto, the semiconductor circuit devices to be tested are disposed and connected up in at least one stack.

Abstract: A temperature sensor is integrated together with an integrated circuit on a chip, the sensor delivering a temperature-dependent measuring signal or at least emitting a signal when the chip temperature falls below a specific prescribed value. For such an eventuality, the chip includes a special circuit device thereon, by which a current flow is generated through a provided structure of electrical conductors that keeps the temperature of the integrated circuit above a prescribed minimum temperature.

Abstract: An interface unit and a printed circuit board configuration includes at least two interface units for linking conventional commercially available packages of integrated circuits on a printed circuit board in a more flexible and compact way, which allows compact high-performance electronic circuits to be produced on a small surface area and with low development expenditure.

Abstract: A test configuration that includes a device and a method for testing the device in which test results determined during the testing of the device are stored in a memory in the device. In this way, the test results are connected with the device and available at any time for later evaluations.

Abstract: A temperature sensor is integrated together with an integrated circuit on a chip, the sensor delivering a temperature-dependent measuring signal or at least emitting a signal when the chip temperature falls below a specific prescribed value. For such an eventuality, the chip includes a special circuit device thereon, by which a current flow is generated through a provided structure of electrical conductors that keeps the temperature of the integrated circuit above a prescribed minimum temperature.

Abstract: A dynamic semiconductor memory and a method for operating such a memory includes memory banks with memory cells disposed in rows, and registers associated with the memory banks for storing an address of an open, activated word line. In the event of an external refresh command, a control device causes, after the refresh operation, the state of the memory banks to be reestablished, in particular, the word line whose address was stored in the register to be reactivated. Such a purely on-chip measure increases the operating speed of the memory.

Abstract: To be able to test a plurality of identical semiconductor circuit devices in a particularly rapid yet reliable manner, a test method includes carrying out the tests in parallel and substantially simultaneously on the plurality of semiconductor circuit devices and driver lines—used in the process—of a test device to the semiconductor circuit devices simultaneously and jointly for all the semiconductor circuit devices. In such a case, test results are read from a plurality of input/output channels in compressed form. Furthermore, as an alternative or in addition thereto, the semiconductor circuit devices to be tested are disposed and connected up in at least one stack.

Abstract: An interface unit and a printed circuit board configuration includes at least two interface units for linking conventional commercially available packages of integrated circuits on a printed circuit board in a more flexible and compact way, which allows compact high-performance electronic circuits to be produced on a small surface area and with low development expenditure.

Abstract: A dynamic semiconductor memory and a method for operating such a memory includes memory banks with memory cells disposed in rows, and registers associated with the memory banks for storing an address of an open, activated word line. In the event of an external refresh command, a control device causes, after the refresh operation, the state of the memory banks to be reestablished, in particular, the word line whose address was stored in the register to be reactivated. Such a purely on-chip measure increases the operating speed of the memory.