Patents by Inventor Reinhard Ecker

Reinhard Ecker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240047100
    Abstract: A feedthrough in a housing component that is subject to thermal loading for a functional assembly includes: an inner conductor; an outer conductor having a sleeve assigned to or formed on the outer conductor that retains or makes it possible to fasten the feedthrough to the housing component; and an electrically insulating component between the outer conductor and the inner conductor, the electrically insulating component retaining the inner conductor relative to the outer conductor in an electrically insulated fashion.
    Type: Application
    Filed: October 20, 2023
    Publication date: February 8, 2024
    Applicant: Schott AG
    Inventors: Helmut Hartl, Reinhard Ecker, Christian Mix
  • Publication number: 20230155345
    Abstract: A socket for an electronic component includes: an electrically insulating material; a base body including at least one opening configured for accommodating an electrically conductive pin configured for being electrically connected to the electronic component, the at least one opening being sealed with the electrically insulating material such that the electrically conductive pin is fed through the at least one opening while being electrically insulated from the base body; and a shell part including a pedestal configured for accommodating the electronic component, at least the shell part of the socket including a metal with a thermal conductivity of at least 100 W/mK.
    Type: Application
    Filed: January 20, 2023
    Publication date: May 18, 2023
    Applicant: Schott AG
    Inventors: Artit Aowudomsuk, Reinhard Ecker
  • Patent number: 11367692
    Abstract: A lens cap for a transistor outline (TO) package is provided that has an inner diameter of less than 4 mm. The lens cap includes a metal shell with a wall thickness of less than 0.2 mm and a thinned area surrounding the lens so that in the thinned area the wall thickness is reduced by at least 35%.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: June 21, 2022
    Assignee: SCHOTT AG
    Inventors: Robert Hettler, Reinhard Ecker, Martin Lindner-Stettenfeld, Georg Mittermeier
  • Publication number: 20210130758
    Abstract: A biocompatible composite element for a bioreactor is provided that includes an outer frame and an inner component. The outer frame is a polymeric material. The outer frame can be inseparably attached to a wall of the bioreactor. The inner component is a transparent material selected from a group consisting of glass, sapphire, and glass ceramic. The inner component is secured in the outer component in an inseparable hermetically tight manner. The inner component is configured for a spectral process control through the transparent material of the inner component.
    Type: Application
    Filed: August 17, 2020
    Publication date: May 6, 2021
    Applicant: SCHOTT AG
    Inventors: Christian Ott, Robert Hettler, Christoph Stangl, Helena Blümel, Reinhard Ecker
  • Publication number: 20200399575
    Abstract: A biocompatible composite element for a bioreactor is provided that includes an outer frame and an inner component. The outer frame is a polymeric material. The outer frame can be inseparably attached to a wall of the bioreactor. The inner component is a transparent material selected from a group consisting of glass, sapphire, and glass ceramic. The inner component is secured in the outer component in an inseparable hermetically tight manner. The inner component is configured for a spectral process control through the transparent material of the inner component.
    Type: Application
    Filed: June 5, 2020
    Publication date: December 24, 2020
    Applicant: SCHOTT AG
    Inventors: Christian Ott, Robert Hettler, Christoph Stangl, Helena Blümel, Reinhard Ecker
  • Publication number: 20170294390
    Abstract: A lens cap for a transistor outline (TO) package is provided that has an inner diameter of less than 4 mm. The lens cap includes a metal shell with a wall thickness of less than 0.2 mm and a thinned area surrounding the lens so that in the thinned area the wall thickness is reduced by at least 35%.
    Type: Application
    Filed: April 7, 2017
    Publication date: October 12, 2017
    Applicant: SCHOTT AG
    Inventors: Robert Hettler, Reinhard Ecker, Martin Lindner-Stettenfeld, Georg Mittermeier