Patents by Inventor Reinhard ERWE

Reinhard ERWE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11486944
    Abstract: An isolating Hall sensor structure having a support structure made of a substrate layer and an oxide layer, a semiconductor region of a first conductivity type which is integrally connected to a top side of the oxide layer, at least one trench extending from the top side of the semiconductor region to the oxide layer of the support structure, at least three first semiconductor contact regions of the first conductivity type, each extending from a top side of the semiconductor region into the semiconductor region. The at least one trench surrounds a box region of the semiconductor region. The first semiconductor contact regions are each arranged in the box region of the semiconductor region and are each spaced apart from one another. A metallic connection contact layer is arranged on each first semiconductor contact region.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: November 1, 2022
    Assignee: TDK-Micronas GmbH
    Inventors: Maria-Cristina Vecchi, Reinhard Erwe, Martin Cornils, Kerwin Khu
  • Patent number: 11437569
    Abstract: A Hall sensor structure comprising a semiconductor body of a first conductivity type, a well region of a second conductivity type extending from a top side of the semiconductor body into the semiconductor body, at least three first semiconductor contact regions of the second conductivity type, each extending from a top side of the well region into the well region, at least one second semiconductor contact region of a second conductivity type, wherein the first semiconductor contact regions are spaced apart from one another and from an edge of the well region, a metallic connection contact layer is arranged on each first semiconductor contact region, the at least one second semiconductor contact region extends along the top side of the semiconductor body at least partially around the well region.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: September 6, 2022
    Assignee: TDK-Micronas GmbH
    Inventors: Maria-Cristina Vecchi, Reinhard Erwe, Martin Cornils, Kerwin Khu
  • Patent number: 11360163
    Abstract: A vertical Hall sensor structure having a substrate layer, a semiconductor area of a first conductivity type, at least a first, a second and a third semiconductor contact area of the first conductivity type extending from an upper surface of the semiconductor area into the semiconductor area, and at least a first semiconductor contact area of a second conductivity type, wherein the semiconductor contact areas of the first conductivity type are spaced apart from each other and a metal connection contact layer is arranged on each semiconductor contact area of the first conductivity type. The first semiconductor contact area of the second conductivity type is adjacent to the first semiconductor contact area of the first conductivity type or is spaced at a distance of at most 0.2 ?m from the first semiconductor contact area of the first conductivity type.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: June 14, 2022
    Assignee: TDK-Micronas GmbH
    Inventors: Maria-Cristina Vecchi, Reinhard Erwe, Martin Cornils, Kerwin Khu
  • Publication number: 20210003641
    Abstract: A vertical Hall sensor structure having a substrate layer, a semiconductor area of a first conductivity type, at least a first, a second and a third semiconductor contact area of the first conductivity type extending from an upper surface of the semiconductor area into the semiconductor area, and at least a first semiconductor contact area of a second conductivity type, wherein the semiconductor contact areas of the first conductivity type are spaced apart from each other and a metal connection contact layer is arranged on each semiconductor contact area of the first conductivity type. The first semiconductor contact area of the second conductivity type is adjacent to the first semiconductor contact area of the first conductivity type or is spaced at a distance of at most 0.2 ?m from the first semiconductor contact area of the first conductivity type.
    Type: Application
    Filed: July 2, 2020
    Publication date: January 7, 2021
    Applicant: TDK-Micronas GmbH
    Inventors: Maria-Cristina VECCHI, Reinhard ERWE, Martin CORNILS, Kerwin KHU
  • Publication number: 20200393523
    Abstract: An isolating Hall sensor structure having a support structure made of a substrate layer and an oxide layer, a semiconductor region of a first conductivity type which is integrally connected to a top side of the oxide layer, at least one trench extending from the top side of the semiconductor region to the oxide layer of the support structure, at least three first semiconductor contact regions of the first conductivity type, each extending from a top side of the semiconductor region into the semiconductor region. The at least one trench surrounds a box region of the semiconductor region. The first semiconductor contact regions are each arranged in the box region of the semiconductor region and are each spaced apart from one another. A metallic connection contact layer is arranged on each first semiconductor contact region.
    Type: Application
    Filed: June 10, 2020
    Publication date: December 17, 2020
    Applicant: TDK-Micronas GmbH
    Inventors: Maria-Cristina VECCHI, Reinhard ERWE, Martin CORNILS, Kerwin KHU
  • Publication number: 20200365796
    Abstract: A Hall sensor structure comprising a semiconductor body of a first conductivity type, a well region of a second conductivity type extending from a top side of the semiconductor body into the semiconductor body, at least three first semiconductor contact regions of the second conductivity type, each extending from a top side of the well region into the well region, at least one second semiconductor contact region of a second conductivity type, wherein the first semiconductor contact regions are spaced apart from one another and from an edge of the well region, a metallic connection contact layer is arranged on each first semiconductor contact region, the at least one second semiconductor contact region extends along the top side of the semiconductor body at least partially around the well region.
    Type: Application
    Filed: May 18, 2020
    Publication date: November 19, 2020
    Applicant: TDK-Micronas GmbH
    Inventors: Maria-Cristina VECCHI, Reinhard ERWE, Martin CORNILS, Kerwin KHU