Patents by Inventor Reinhard Fritz
Reinhard Fritz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7733657Abstract: In a module base unit (1) for a module (30) for a data carrier, two connection plates (2, 3) are provided, which comprise electrically conductive material and which each have a direction of extent (4, 5) and which are separated from each other by a gap (16) transverse to the two directions of extent (4, 5), and at least one strain relief member (34) is connected to the two connection plates (2, 3), which strain relief member (34) is constructed to absorb tensile forces occurring parallel to the directions of extent (4, 5) and acting on the connection plates (2, 3).Type: GrantFiled: July 26, 2005Date of Patent: June 8, 2010Assignee: NXP B.V.Inventors: Reinhard Fritz, Gerald Schaffler, Joachim Schober
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Publication number: 20090190314Abstract: In a module base unit (1) for a module (30) for a data carrier, two connection plates (2, 3) are provided, which comprise electrically conductive material and which each have a direction of extent (4, 5) and which are separated from each other by a gap (16) transverse to the two directions of extent (4, 5), and at least one strain relief member (34) is connected to the two connection plates (2, 3), which strain relief member (34) is constructed to absorb tensile forces occurring parallel to the directions of extent (4, 5) and acting on the connection plates (2, 3).Type: ApplicationFiled: July 26, 2005Publication date: July 30, 2009Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: Reinhard Fritz, Gerald Schaffler, Joachim Heinz Schober
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Patent number: 7521271Abstract: A method of manufacturing a transponder (1) where a transponder IC (2) comprising two IC contacts (7, 8) is brought into communication-capable connection, via each time one of the IC contacts (7, 8), with one of two transmission element strips (13, 14) provided on a tape-like carrier (11) of an intermediate product (12), the intermediate product (12) then being cut through along cutting zones (16) extending perpendicularly to the longitudinal direction of the carrier and the transponder IC (2) being connected to the portion of the intermediate product (12) located between two cutting zones (16).Type: GrantFiled: February 3, 2003Date of Patent: April 21, 2009Assignee: NXP B.V.Inventors: Christian Brugger, Reinhard Fritz
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Patent number: 7361976Abstract: In a lead-frame configuration (60), a module (70) and a data carrier (72), two connecting plates (12, 13) of the module (70), which are each intended for connection to a connecting contact or bump (47, 48) of a chip (41), are connected to a reinforcement film (66, 71) formed from a fiber-reinforced film of plastics material by means of a layer (73) of an adhesive that is particularly well suited to transmitting shear forces, in which case there is additionally provided in an advantageous further embodiment, on the reinforcement film (66, 71), at least one further layer (74, 75, 76) that is able to serve for protecting, damping or fastening purposes.Type: GrantFiled: October 31, 2003Date of Patent: April 22, 2008Assignee: NXP B.V.Inventors: Reinhard Fritz, Peter Schmallegger, Somnuk Akkahadsi
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Publication number: 20060159897Abstract: In a lead-frame configuration (60), a module (70) and a data carrier (72), two connecting plates (12, 13) of the module (70), which are each intended for connection to a connecting contact or bump (47,48) of a chip (41), are connected to a reinforcement film (66, 71) formed from a fiber-reinforced film of plastics material by means of a layer (73) of an adhesive that is particularly well suited to transmitting shear forces, in which case there is additionally provided in an advantageous further embodiment, on the reinforcement film (66, 71), at least one further layer (74, 75, 76) that is able to serve for protecting, damping or fastening purposes.Type: ApplicationFiled: October 31, 2003Publication date: July 20, 2006Applicant: KONINKLIJKE PHILIPS ELECTRONICC N.V.Inventors: Reinhard Fritz, Peter Schmallegger, Sommuk Akkahadsi
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Publication number: 20050181530Abstract: A method of manufacturing a transponder (1) where a transponder IC (2) comprising two IC contacts (7, 8) is brought into communication-capable connection, via each time one of the IC contacts (7, 8), with one of two transmission element strips (13, 14) provided on a tape-like carrier (11) of an intermediate product (12), the intermediate product (12) then being cut through along cutting zones (16) extending perpendicularly to the longitudinal direction of the carrier and the transponder IC (2) being connected to the portion of the intermediate product (12) located between two cutting zones (16).Type: ApplicationFiled: February 3, 2003Publication date: August 18, 2005Inventors: Christian Brugger, Reinhard Fritz
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Patent number: 6867111Abstract: In a method of manufacturing modules (4), each with at least one integrated circuit (2), the integrated circuits (2) are separated from a previously manufactured circuit configuration (1), which is in the form of a flexible film comprising a plurality of integrated circuits (2) on the basis of a polymer, by a combined stamping-vacuum conveying device (6), after which each of the separated integrated circuits (2) is conveyed to a module substrate (5) and connected to the module substrate (5) so as to form a module (4).Type: GrantFiled: October 28, 2002Date of Patent: March 15, 2005Assignee: Koninklijke Philips Electronics N.V.Inventors: Christian Brugger, Reinhard Fritz, Anthonie Arie De Lange, Johannes Henricus Maria Van Roosmalen, Johannus Wilhelmus Weekamp
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Patent number: 6737732Abstract: A data carrier (1) for contactless communication comprises a first carrier layer (2) and a second carrier layer (3) which are held together by an adhesive layer (15), wherein an integrated circuit (11) is held in a given position between one of the two carrier layers (2, 3) and the adhesive layer (15), the circuit comprising transmission means (13, 14) which can communicate in a contactless manner with transmission means (7, 8) at the carrier layer, and the transmission means (7, 8) of the carrier layer are connected with electrical conduction to further transmission means (5, 6) by which a contactless communication with a communication station can be carried out, and wherein the final, mechanically stable retention of the integrated circuit (11) in the position reserved for it in the data carrier (1) is realized by means of the adhesive layer (15) only.Type: GrantFiled: June 25, 2002Date of Patent: May 18, 2004Assignee: Koninklijke Philips Electronics N.V.Inventors: Reinhard Fritz, Gerardus Franciscus Cornelis Maria Lijten, Hubertus Henricus Alphonsus Winters
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Publication number: 20030087474Abstract: In a method of manufacturing modules (4), each with at least one integrated circuit (2), the integrated circuits (2) are separated from a previously manufactured circuit configuration (1), which is in the form of a flexible film comprising a plurality of integrated circuits (2) on the basis of a polymer, by a combined stamping-vacuum conveying device (6), after which each of the separated integrated circuits (2) is conveyed to a module substrate (5) and connected to the module substrate (5) so as to form a module (4).Type: ApplicationFiled: October 28, 2002Publication date: May 8, 2003Inventors: Christian Brugger, Reinhard Fritz, Anthonie Arie De Lange, Johannes Henricus Maria Van Roosmalen, Johannus Wilhelmus Weekamp
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Publication number: 20030016134Abstract: A data carrier (1) for contactless communication comprises a first carrier layer (2) and a second carrier layer (3) which are held together by an adhesive layer (15), wherein an integrated circuit (11) is held in a given position between one of the two carrier layers (2, 3) and the adhesive layer (15), the circuit comprising transmission means (13, 14) which can communicate in a contactless manner with transmission means (7, 8) at the carrier layer, and the transmission means (7, 8) of the carrier layer are connected with electrical conduction to further transmission means (5, 6) by which a contactless communication with a communication station can be carried out, and wherein the final, mechanically stable retention of the integrated circuit (11) in the position reserved for it in the data carrier (1) is realized by means of the adhesive layer (15) only.Type: ApplicationFiled: June 25, 2002Publication date: January 23, 2003Inventors: Reinhard Fritz, Gerardus Franciscus Cornelis Maria Lijten, Hubertus Henricus Alphonsus Winters