Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

Abstract: According to an embodiment, a microfabricated structure includes a cavity disposed in a substrate, a first clamping layer overlying the substrate, a deflectable membrane overlying the first clamping layer, and a second clamping layer overlying the deflectable membrane. A portion of the second clamping layer overlaps the cavity.

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

Abstract: A method for producing an electric contact-connection of a multilayer component is disclosed. In an embodiment, the method includes providing a main body of the multilayer component having internal electrode layers, applying an electrically conductive material and applying a photosensitive material on the electrically conductive material. The method further includes structuring the electrically conductive material via the photosensitive material such that the internal electrode layers alternatingly are covered and uncovered by the electrically conductive material and applying an insulating material after structuring the electrically conductive material such that the internal electrode layers are alternatingly covered by the electrically conductive material and by the insulating material.

Abstract: A piezoelectric actuator of a multilayer design includes outer electrodes that are fastened by means of a bonding layer applied by thermal spraying. For example, the outer electrodes are formed as a woven wire fabric. Furthermore, a method for fastening an outer electrode in a piezoelectric actuator is specified.

Abstract: According to an embodiment, a microfabricated structure includes a cavity disposed in a substrate, a first clamping layer overlying the substrate, a deflectable membrane overlying the first clamping layer, and a second clamping layer overlying the deflectable membrane. A portion of the second clamping layer overlaps the cavity.

Abstract: According to an embodiment, a microfabricated structure includes a cavity disposed in a substrate, a first clamping layer overlying the substrate, a deflectable membrane overlying the first clamping layer, and a second clamping layer overlying the deflectable membrane. A portion of the second clamping layer overlaps the cavity.

Abstract: A stackable piezoelectric actuator component (100) comprises a stack (10) of piezoelectric layers (11) and electrode layers (12) arranged therebetween, a voltage supply device (20) arranged outside the stack (10) and serving for making electrical contact with the electrode layers, a contact connection (30) for applying a voltage to the voltage supply device (20) and a further contact connection (40), which is electrically coupled to the voltage supply device (20). The contact connection (30) and the further contact connection (40) are designed complementarily with respect to one another in such a way that a further stackable piezoelectric actuator component (200), comprising at least a contact connection or a further contact connection (30, 40), can be electrically coupled to the actuator component (100).

Abstract: The invention relates to an actuator (1) having stacked piezoelements (16), first and second inner electrodes (5, 3) disposed alternatingly between the piezoelements (16), a first outer electrode (4) which is electrically conductively connected to the first inner electrode (5), a second outer electrode (2) which is electrically conductively connected to the second inner electrode (3), characterized in that the actuator (1) comprises a plurality of actuator segments (81, 82, 83, 84, 85) and that the second outer electrode (2) comprises separate electrode segments (21, 22, 23, 24, 25) each of which are electrically conductively connected to the second inner electrodes (3) in one of the actuator segments (81, 82, 83, 84, 85).

Abstract: The invention relates to an actuator having a sensor layer by which a temperature can be detected, and to a method for producing the same.

Abstract: According to an embodiment, a microfabricated structure includes a cavity disposed in a substrate, a first clamping layer overlying the substrate, a deflectable membrane overlying the first clamping layer, and a second clamping layer overlying the deflectable membrane. A portion of the second clamping layer overlaps the cavity.

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

Abstract: A piezoelectric actuator of a multilayer design includes outer electrodes that are fastened by means of a bonding layer applied by thermal spraying. For example, the outer electrodes are formed as a woven wire fabric. Furthermore, a method for fastening an outer electrode in a piezoelectric actuator is specified.

Abstract: In the method for monitoring flexural vibrations of a piezoactuator, a small-signal spectrum of a piezoactuator, which is provided and mounted for the purpose of exciting longitudinal vibrations, is measured and an excitation of a transverse vibration in the piezoactuator is detected from resonances occurring in the small-signal spectrum.

Abstract: A piezoelectric actuator of a multilayer design includes outer electrodes that are fastened by means of a bonding layer applied by thermal spraying. For example, the outer electrodes are formed as a woven wire fabric. Furthermore, a method for fastening an outer electrode in a piezoelectric actuator is specified.

Abstract: A method for producing an electric contact-connection of a multilayer component is specified. A main body has internal electrode layers, a insulating material, an electrically conductive material and a photosensitive material are provided. The insulating material and the electrically conductive material are arranged in a structured manner on an outer side of the multilayer component for the alternate contact-connection of the internal electrode layers. The structured arrangement is produced by the photosensitive material. A multilayer component comprising such a contact-connection is furthermore specified.

Abstract: A solder material can be used for fastening an outer electrode on a piezoelectric component. The solder material contains tin as the main constituent and at least one addition from the group of cobalt, tungsten, osmium, titanium, vanadium, iron and rare earth metals. A piezoelectric component includes such a solder material. The solder material is applied by means of a base metallization.